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E-mail
19175269088@163.com
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Phone
15876446198
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Address
Room 102, Building 1, No. 101 Zhongxin Road, Changping Town, Dongguan City, Guangdong Province
About Us
Guangdong Haotian Testing Instrument Co., Ltd
Date: 2025-09-02Read: 4
In the mass production process of semiconductor chips, the performance stability under high and low temperature environments is a key factor determining product yield. Domestic leading semiconductor companies once faced the problem of high failure rates in the mass production of automotive grade chips, and introduced GuanghaotanThermal Shock ChamberLater, by accurately simulating high and low temperature cycling environments, the failure rate of chip mass production was significantly reduced, making it a reliable testing tool in the industry.
This semiconductor company mainly produces automotive grade and industrial grade chips. Previously, due to the slow temperature change rate and low temperature control accuracy of traditional testing equipment, it was impossible to simulate the working state of chips in the environment, resulting in frequent failures such as solder joint cracking and electrical performance drift caused by temperature stress after the chips were manufactured. Guanghao Tian has customized products with a wide temperature range of -60 ℃ to 150 ℃ to meet the needs of enterprisesThermal Shock ChamberIts temperature change rate can reach 30 ℃ per minute, with a conversion time of ≤ 5 seconds, which meets the AEC-Q100 automotive electronic testing standard of -55 ℃? +Strict requirements of 150 ℃.
In the testing process, Guang HaotianThermal Shock ChamberAdopting the "temperature change aging re temperature change" cycle mode, the chip is first placed in a high temperature zone of 125 ℃ for 4-hour aging testing, synchronously monitoring electrical performance parameters, and then quickly switched to a low temperature zone of -40 ℃ for 30 minutes of temperature change impact. This cycle is repeated 500 times. The built-in multi-channel independent temperature control aging board of the device can perform parallel testing on 200 chips at the same time. Coupled with an automated acquisition system that collects 100 sets of data per second, it can accurately capture the performance abnormalities of chips under sudden temperature changes.
With the temperature control accuracy of ± 0.5 ℃ and temperature uniformity of ± 1 ℃ in the cold and hot shock box, the enterprise has successfully identified the problem of mismatched thermal expansion coefficients in the chip packaging process. By optimizing packaging materials based on test data, the incidence of microcracks in chip solder joints was reduced by 40%, and the drift of electrical performance parameters was controlled within ± 10%. At the same time, the testing cycle has been compressed from the traditional 72 hours to 48 hours, and the efficiency of single batch testing has been improved by 30%. An additional 60 batches of testing are completed each year, and the chip factory yield has increased from 98% to 99.5%.
The Guanghao Tian cold and hot shock box not only builds a quality defense line for chip companies, but also helps companies shorten their research and development cycles and reduce testing costs through customized services and full cycle technical support, injecting strong impetus into the high-quality development of the semiconductor industry.