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Common packaging defects and detection methods of piezoelectric ceramics in mechanical packaging
Date: 2025-07-14Read: 10
Mechanical packaging of piezoelectric ceramicsAs a precision driving component, the packaging quality directly affects its vibration performance and service life. During production and use, common packaging defects need to be detected in a timely manner through scientific testing to avoid equipment failure.
There are three main types of common packaging defects. One is interface bubbles and voids, which are often caused by uneven application of encapsulation adhesive or incomplete exhaust during curing, which can reduce the bonding strength between ceramic and metal shells and easily lead to local stress concentration during vibration. The second is the cracking of the packaging shell, which often occurs at the corners and edges, and is often caused by excessive mechanical stress or insufficient material toughness during the packaging process. The propagation of cracks may lead to moisture or impact damage to ceramic components. The third is lead welding defects, including virtual soldering, open solder joints, etc., which can cause unstable electrical signal transmission, manifested as abnormal driving voltage or output power attenuation.
Targeted detection methods are needed to address these defects. For interface bubbles, ultrasonic testing is an efficient method: by scanning the package with a 5-10MHz probe, the bubbles will show obvious echo signals. Combined with imaging technology, the defect position and size can be located, and the detection accuracy can reach 0.1mm level. Penetration testing is more suitable for detecting cracks in packaging shells. Fluorescent penetrant is applied to the surface of the shell, and after cleaning and imaging, fluorescent traces will appear at the crack site, especially suitable for detecting surface microcracks. Defects in lead welding can be investigated by combining resistance testing with infrared thermal imaging: measuring the resistance of the solder joint with a multimeter, if it exceeds 0.5 Ω, there may be virtual welding; The infrared thermal imager can capture the abnormal temperature rise of solder joints after power on, accurately identifying areas of poor contact.
In addition, vibration testing can verify the overall reliability of the package. Connect the piezoelectric ceramic to the rated voltage, sweep and vibrate within the frequency range of 10-1000Hz, and monitor the amplitude uniformity through a laser vibrometer. If abnormal fluctuations occur, it may be caused by loose packaging or internal defects. For mass-produced products, helium mass spectrometry leak detection can also be used to check the sealing of the packaging. When the leakage rate exceeds 1 × 10 ⁻⁸ Pa · m ³/s, it needs to be resealed.
In practical testing, it is recommended to combine multiple methods for comprehensive judgment. For example, after ultrasonic testing detects interface defects, the impact on performance can be evaluated through vibration testing. Timely detection and handling of packaging defects can effectively improveMechanical packaging of piezoelectric ceramicsStability and extended service life in scenarios such as ultrasound equipment and precision valves.