Troubleshooting and Solution for Magnetic Flip Plate Liquid Level Gauge

1、 Reason for malfunction of liquid level rise and fall and no indication on the instrument: 1. Float leakage or damage; 2. Float demagnetization; 3. There are foreign objects inside the float chamber, and the float is stuck or unable to rise or fall.

Troubleshooting method: 1. Clean the measuring bucket of the liquid level gauge; 2. Replace the float.

2、 Reason for abnormal flip column indication: demagnetization of the magnetic flip column.

Troubleshooting method: Replace some demagnetized flip columns.

3、 Instrument leakage:

1. Reason for malfunction: The sealing part is not sealed properly. Troubleshooting method: Press the cover tightly;

2. Cause of malfunction: Damaged seal. Troubleshooting method: Replace the sealing gasket;

3. Cause of malfunction: Weld seam cracking. Troubleshooting method: Repair welding or send to the manufacturer for repair.

Of courseAnti corrosion magnetic flap level gaugeThere are other troubleshooting methods available:

1、 Observation method. Utilize visual, olfactory, and tactile senses. Sometimes, damaged components may discolor, bubble, or show burnt spots; Burned components will produce some special odors; Short circuited chips will heat up; Virtual welding or detachment can also be observed with the naked eye. This method is more suitable for experienced staff.

2、 Comparison method. Two instruments of the same model are required, and one magnetic float level gauge is operating normally. Necessary equipment such as multimeters and oscilloscopes are also required to use this method. According to the nature of comparison, there are voltage comparison, waveform comparison, static impedance comparison, output result comparison, current comparison, etc.

3、 Substitution method. Require two instruments of the same model with remote magnetic flap level gauges or sufficient spare parts. Replace a good spare part with the same component on the faulty machine and see if the fault is eliminated.

4、 Exclusion method. The method of determining the cause of faults by plugging and unplugging some plug-in boards and components inside the machine. When the instrument returns to normal after removing a certain plug-in board or component, it indicates that the fault occurred there.

5、 Parallel method. Install a good IC chip on top of the chip to be inspected, or connect good components (resistors, capacitors, diodes, transistors, etc.) in parallel with the components to be inspected, maintaining good contact. If the fault is caused by an open circuit or poor contact inside the device, this method can be used to eliminate it.

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