Semiconductor 90 degree peel testing machineIt is designed for ceramic copper-clad substrates such as DCB (direct copper-clad), AMB (active metal brazing), DPC (direct electroplated copper), etc. These substrates are the core components of power semiconductors, new energy vehicle motor controllers, 5G base station RF modules, and can be used to test the adhesion between copper foil and ceramic substrates. It can also be used to test semiconductor circuit boards such as PCB (printed circuit board), PCBS board, FPC (flexible circuit board), etc., to test the peel resistance between copper foil and substrate. It can also be used to test the adhesion between semiconductor packaging tape (such as pressure-sensitive tape, adhesive, 3M adhesive), semiconductor film and other materials and the adhesion between other semiconductor tin foil, aluminum foil, semiconductor correction tape and substrate; The working principle is to conduct tensile testing on the peeled sample at a 90 degree vertical angle, in order to measure key parameters such as peel strength, average peel force, large peel force, and small peel force.

Hengyi Semiconductor 90 degree peeling test machine meets the standard：

IPC-TM-650 (Printed Circuit Industry Standard): specifies the peel test method for copper-clad laminates;

GB/T4677 (Chinese National Standard): Applicable to the testing of copper-clad laminates for printed circuits;

GB/T13557 (Chinese National Standard): Testing for metal based copper-clad laminates for printed boards;

DIN/ISO/JIS/ASTM (optional): Some equipment supports EU, international, Japanese, American and other standards (such as customized according to customer needs).

Advantages of Hengyi Semiconductor 90 degree Peel Testing MachineCompared with traditional material testing machines, the 90 degree peel strength testing machine for ceramic substrates has no lateral additional force, ensures 90 degree verticality, and uses a one click self-locking fixture to quickly clamp the sample, greatly improving testing efficiency.

Hengyi Semiconductor 90 degree Peel Testing MachineTechnical Specifications:

1. Specification: HY (BL)

2. Accuracy level: Level 0.5

3. Load: 200N

4. Effective force measurement range: 0.1/100-100;

5. Test force resolution, with a load of 500000 yards; There is no distinction between internal and external, and the resolution remains unchanged throughout the entire process.

6. Effective test width: 50mm

7. Effective experimental space: 120mm

8. Test speed: 0.001~300mm/min (adjustable arbitrarily)

9. Speed accuracy: within ± 0.5% of the displayed value;

10. Displacement measurement accuracy: within ± 0.5% of the displayed value;

11. Deformation measurement accuracy: within ± 0.5% of the displayed value;

12. Test bench lifting device: fast/slow speed control, can be inched;

13. Test bench safety device: electronic limit protection

14. Test bench return: Manual can return to the initial position of the test at high speed, and automatic can return automatically after the test is completed;

15. Overload protection: Automatic protection when the maximum load exceeds 10%;

16. Motor: 200W

17. Host weight: 60kg