FPC 90 ° Peel Testing Machine

The Hengyi FPC 90 ° Peel Tester is mainly used to test the adhesion strength between copper foil and substrate in flexible circuit boards (FPCs). The slider is at a 45 ° angle to the horizontal and moves synchronously with the object being peeled during testing to meet the requirements of vertical peel testing, thereby measuring its peel resistance, peel strength, average peel strength, average peel strength, etc.