MURATANET Murata Co., Ltd

Printed Circuit Board: Circuit Formation

Acid degreasing

PAC-150 Shower cleaner/low foaming, foam disappearance is also good

PAC-200 Immersion cleaner/very low surface tension/good wettability

PAC-MA80 By using it in combination with an acidic cleaner, the wettability can be improved

PAC-210 Effectively remove immersion cleaners/organic dirt, etc

Soft etching

MEOX Toxic and harmful substances, toxic and harmful substances, toxic and harmful substances, toxic and harmful substances

MEOX-CPX2 Smooth out the unevenness of dense etching/copper surface

Copper pyrophosphate coating

Piroxicam Adding a bath is simple

CP-2×2 Uniform electrodeposition with good/rough properties

Prevent discoloration

CAT Acidic type/with oxide film removal effect/no precipitate formation

Efshain Cu Neutral type/Good weldability/Low contact resistance

Printed Circuit Board: Surface Treatment of Wiring Patterns

ØNickel gold/tin/silver

Alkaline degreasing

MRC-200L Effectively remove weak alkaline cleaners/uncured corrosion inhibitors, etc

DSL-100 Alkaline anode electrolytic detergent/micro etching/good residual removal performance

Neutral degreasing

PAC-310X Very low surface tension and good wettability

Acid degreasing

PAC-150 Printed circuit board acid cleaner for spraying/low foaming, foam disappearance is also good

PAC-200 Acidic impregnation cleaner/very low surface tension, good wetting properties

PAC-MA80 By combining with an acidic cleaner, the wettability can be improved

PAC-210 Less damage to the substrate, effectively removing organic dirt, etc

PAC-400 Relaxation of abnormal precipitation in spatial areas of high-density wiring substrates

Soft etching

MEOX Etching that does not belong to toxic hazardous materials, with good precision and minimal residue

MEOX-CPX2 Smooth out the unevenness of dense etching/copper surface

Acid soaking

SAS Removing scale and oxide film/toxic substances outside of restricted objects/wastewater treatment is easy

Amino sulfonic acid nickel plating concentrate

SN Kongke High purity product/good uniform electrodeposition/Ni composition: min150g/l

SN hole 185 High purity product/good uniform electrodeposition/Ni composition: min180g/l

Nickel plating additive

SN-500/2000 Improve the gloss of low current density areas

NP-A Anti pit agent/low foaming property (effective in air agitation bath)/does not affect the appearance and physical properties

Electrolytic nickel

EleN-Ni111 is lead-free, low stress, and has good corrosion resistance, making it suitable as a replacement gold based nickel substrate

ØPre soldering treatment

Acid degreasing

PAC-150 Shower acid cleaner/low foaming, foam disappearance is also good

Soft etching

MEOX Etching that does not belong to toxic hazardous materials, with good precision and minimal residue

Flux processing

Heat resistant pre soldering flux

Printed Circuit Board: Ceramic Circuit Board

Neutral degreasing

PAC-310X Very low surface tension/good wettability

Pd catalyst

Neutral Pd catalyst liquid

Electroless nickel plating

EleN-Ni111 Suitable as LTCC counterpart/material with low impact/low stress/displacement gold based nickel

Connector/lead frame

Immersion electrolytic degreasing

RCS-11 Powder degreaser enhances degreasing power, auxiliary agent/cloud point, high temperature

RCS-18 Defatting corresponding/reducing liquid renewal through the use of ultrasonic pressure reducers

RCS-21 Low foaming/good foam breaking/mineral oil with alkaline detergent has good degreasing properties

RCS-23 High speed degreasing treatment corresponds to/low foaming/good drainage treatment

RCS-11 It is a component with weak metal adsorption and can be used in combination with composition/cyan, etc

etching

MEOX Etching that does not belong to toxic hazardous substances/has good precision/minimal residue

MEOX-CPX2 Smooth out the unevenness of dense etching/copper surface

Oxygen activation treatment

MEOX Promote activation/no generation of powder scale through micro etching

SAS Hydrochloric acid/toxic substances are not the target

Amino sulfonic acid nickel plating concentrate

SN hole 185 High purity product/good uniform electrodeposition/Ni composition: min180g/l

Nickel plating additive

SN-1000/2000 Can be adjusted for appearance by using high current for both purpose and 2000

SN-20 No S/good flexibility/corrosion resistance/good heat resistance/inhibits metal diffusion

SN-100 Widely applicable concentration range, easy to manage

NP-A Electroplating solution surface tension reducer/prevents dents/suppresses extrusion/improves wettability

SN-CSB Nickel aminosulfonate bath uses boric acid instead of buffering agent (boron free)

Electroforming/Metal Mask

Acid degreasing

PAC-200 Good degreasing power/very low surface tension/excellent wettability

中性/碱脱脂

RCS-18.21.23 Based on the presence or absence of detergent aids, neutral to alkaline degreasing baths/degreasing/wetting can be made with good properties

Amino sulfonic acid nickel plating concentrate

SN hole 185 High current available/high-purity product/good uniform electrodeposition/Ni content: min180g/l

Nickel plating additive

SN-100 Stress hardness regulator/easy to manage

NP-A Surface tension reducing agent/prevents pits/endows plating solution with good wetting properties

SN-CSB Nickel aminosulfonate bath uses boric acid instead of buffering agent (boron free)

Copper sulfate plating

EF-A Copper sulfate/minimal changes in physical properties caused by heating or placement

NP-A Electroplating solution surface tension reducer/prevents pits/improves wettability

Copper pyrophosphate coating

CP-2×2 Alkaline bath/low stress, good uniform electrodeposition properties

diamond tools

Immersion/electrolytic cleaning degreasing

RCS-11 Powder degreaser enhances degreasing power, auxiliary agent/cloud point, high temperature

RCS-18 Defatting corresponding/reducing liquid renewal through the use of ultrasonic pressure reducers

RCS-21 Low foaming/good foam breaking/mineral oil with alkaline detergent for good degreasing

RCS-23 High speed degreasing treatment corresponding/low foaming/good drainage treatment

Acid soaking

SAS Not in compliance with regulations for hydrochloric acid/toxic substances

Amino sulfonic acid nickel plating concentrate

SN hole 185 High purity product/good uniform electrodeposition/Ni composition: min180g/l

Nickel plating additive

SN-100 Stress reducing agent/hardness adjustment/easy management

SN-CSB Nickel aminosulfonate bath uses boric acid instead of buffering agent (boron free)

NP-A Surface tension reducing agent for plating solution/Improvement of penetration of diamond plating solution/Improvement of diamond wettability

Nickel coating additive for tile

NA-1000/2000 Makeup electroplating/good gloss

Electroless nickel plating

EleN-Ni200 Lead free/high phosphorus type/low stress/high corrosion resistance

EleN-Ni210 Lead free/medium phosphorus type/low stress/long-life type

ØDiamond tool: Nickel stripping solution

Electrolytic nickel

NX/B Nickel plating stripping agent for iron materials that are not easily rough (cyanide free type)

NF/B 1 slot can peel off electrolytic nickel and electrolytic nickel/long life/iron material is not easy to rough/cyanide free

Electrolytic nickel

NX2/B Stripping agent for electroless nickel plating (cyanide free)/supports high phosphorus stripping

carbon fiber

Continuous electroplating By using non-contact electrolytic plating method, a hydrogen impermeable film can be formed on the metal without damaging the carbon fiber

Hydrogen impermeable membrane

Electrolytic nickel (EleN-Ni200) Good prevention of hydrogen permeation

Metal surface rust inhibitor

LS-210L Form protective film on various metals/prevent discoloration and oxidation

Various electroplating: nickel plating

Half gloss nickel (marked as 80)

M-801/802 Double nickel substrate/good flexibility

Glossy Nickel (Zodiac)

ZD -a / 100 / 220 Double nickel with deep luster/good leveling, using glossy nickel

Glossy nickel (nickel ace)

NA-100 A gloss agent with a wide management scope

NA-1000/2000 Widely managed dual nickel glossy nickel

Anti pit agent

NP-A Surface tension reducing agent/preventing dents

Fe impurity remover

ICA Removing eutectoid by electrolysis

Various electroplating methods: copper plating

Copper pyrophosphate coating

Piloden Kongke Concentrated solution of copper pyrophosphate plating solution

CP-2×2 Gloss additive

Copper sulfate plating

CX-A/B Additive/Matte Appearance

NP-A Wetting agent (to prevent dents)

Various electroplating: galvanizing

Acidic galvanizing

SurTec753 Excellent uniform electrodeposition performance/capable of mirror gloss plating

SurTec758 No halogen compound additives/good chemical conversion treatment properties

Cyanide free alkaline zinc plating

SurTec704 Uniform electrodeposition with good/no bending/capable of achieving a glossy coating with low internal stress

Galvanized alloy

SurTec717 Generate zinc nickel alloy film containing ultra uniformity/low-temperature operation process/12-15% Ni

Prevent discoloration

copper counterpart

CAT Has acidic/oxide removal properties

Efshain Cu Neutral type/low contact resistance/good weldability

Chemical conversion treatment of zinc (alloy)

Trivalent chromium chemical conversion treatment agent

SurTec680 6 price chromium free/color bleeding: 4493930/3597542

SurTec680LC 6 price chromium free/color bleeding: 4493930/3597542

Chemical conversion treatment of aluminum (alloy)

degreaser

MGC-13 Suitable for removing oily processing oils/can also be used except for high cloud point types/aluminum

Active acid

SAS Suitable for removing dirt and scale/chlorine based substances

Trivalent chromium chemical conversion treatment agent

SurTec650 High corrosion resistance/good coating adhesion/alternative process for phosphoric acid treatment

SurTec609 Alternative process of phosphoric acid treatment/can also be used as a coating substrate other than aluminum

steel

Electrolytic nickel

EleN-Ni200 Lead free/high phosphorus chemical nickel plating solution, excellent resistance to nitrate and acid

EleN-Ni210 Lead free/medium phosphorus type long-life electroless nickel plating solution

Appearance adjustment

ØHair line/extinction

Nickel electroplating

Nickel ferrite NA-A Flat/Plane

copper plating

CX-A/B Glossy appearance/even sandblasting

Blacking treatment

nickel plating

BKN Electroplating for black plating

electroless nickel plating

CMN-N Lead free electroless nickel plating solution for blackening treatment

CMN-B1/B2 CMN-N blackening treatment solution

Nickel stripping solution

Used for electrolytic nickel

NX/B Shortage of steel

Non electrolytic nickel

NX2/B Non electrolytic nickel stripping agent for steel materials (cyanide free type)

Fixture stripping liquid

RES Safe electroplating and peeling without damaging stainless steel fixtures

Prevent excessive handling during material picking

Fe Iron corrosion inhibitor

abrasive

abrasive

A-100 Iron, aluminum, die cast zinc, and various other metal types (can be ground down and precision machined) experience less wear and tear

M-1000 Tripoli Aluminum, zinc die-casting, other die-casting grinding models, good gloss

#1900 Tripoli Iron and aluminum profiles (can be ground down and precision machined)

Grating Lem C Really? Copper plated, stainless steel plated, nickel plated, synthetic resin type (can be ground down and precision processed), with less wear and good luster

Grating Line # 350 Really? White, synthetic resin type (can be ground down and precision processed), with less wear and good luster

Blue Stick # 5 Super glossy facing iron, really? Die cast zinc, aluminum, stainless steel, gold, silver, chrome plating

Blue Stick # 45 Iron, really? Low cost versions of copper plated, die cast zinc, stainless steel, gold, silver, and chrome plated # 5 can also be used for bottom brushing

Measurement of electroplating thickness and grinding

Precision grinding of semiconductor relationships

Precision grinding of hard alloy

Gemstone grinding

Ceramic polishing

Diamond UF-1 (0~1 μ m)

Diamond UF-2 (0-2 μ m)

Diamond F-3 (0-3 μ m)

Metal wire F-4 (2-6 μ m)

Diamond F-6 (3-8 μ m)

Diamond M-8 (5-12 μ m)

Diamond M-15 (8-20 μ m)

Diamond O-30 (20-30 μ m)

Diamond O-40 (30-40 μ m)

High precision grinding performance in a short period of time

A paste that easily adheres to all cutting tools

The expandability of diamond used in railway, railway, and super-high railways

The processed material does not undergo chemical changes

After grinding, it can be easily cleaned and removed

Recycling and utilization technology of electroless nickel plating solution

equipment

Synchronize the recovery device/electroplating load of our company's chemical nickel plating solution with the on-site installation type

Recycling electroplating solution

EleN Ni Various Recycling chemical nickel plating solution

ØRoller tool - degreaser for scrolls

degreaser

RCS series Excluding n, p/reducing silt content/improving working environment

ØHexavalent chromium free

Chemical conversion treatment of zinc (alloy)

SurTec680 6 price chromium free/color bleeding: 4493930/3597542

SurTec680LC 6 price chromium free/color bleeding: 4493930/3597542

ØChromium/cobalt free chemical coating

Zinc (alloy) treated with trivalent chromium chemical conversion

MRT-012NC CNC REACH compliant/cobalt free trivalent chromium treatment agent/interference color, with good corrosion resistance

ProS-Z Chromium free chemical conversion treatment agent for zinc: No. 4436885/4830032

ØCopper etchant

etchant

MEOX Dangerous goods, toxic substances, highly toxic substances, etc. do not comply with regulations/have good drainage treatment properties

Boron free compound

Nickel aminosulfonate buffer

SN-CSB Boric acid substitute product for nickel plating with amino sulfonic acid