2026 Semiconductor Industry and Electronic Technology (Hefei) Exhibition

The 2026 World Manufacturing Conference will be held from September 20th to 23rd at the Binhu International Convention and Exhibition Center in Hefei. As one of the market-oriented themed exhibitions of the conference, the Semiconductor Industry and Electronic Technology Exhibition aims to create a leading, high-energy, and internationally influential open cooperation platform. At present, the preparation work for the exhibition has been fully launched!

The electronic information manufacturing industry is the "first growth pole" of Anhui's industry, and the semiconductor industry is the core support of this growth pole. At present, Anhui has formed an industrial pattern with Hefei as the core and coordinated development in Wuhu, Chuzhou, Bengbu, Tongling, Chizhou and other places. It has a complete integrated circuit industry chain from chip design, manufacturing, packaging and testing to equipment and materials, gathering more than 500 upstream and downstream enterprises, and cultivating a number of leading enterprises such as Changxin Storage and Jinghe Integration. In 2025, the added value of Anhui's electronic information industry will increase by 40.9% year-on-year, among which the added value of integrated circuit manufacturing above designated size industry will increase by 185.4% year-on-year, and the output of integrated circuits will reach 11.13 billion blocks, an increase of 9% year-on-year.

In the first year of the 15th Five Year Plan, Anhui Province will further leverage industrial synergy and strive to form a new batch of growth points in sub sectors such as integrated circuits, new displays, and artificial intelligence terminals, continuously injecting new momentum into the high-quality development of the electronic information manufacturing industry. The list of key projects in Anhui Province for 2026 has been released, with multiple semiconductor projects on the list:

Exhibition scope: Complete coverage of the semiconductor and electronics industry chain

This exhibition will run through the entire semiconductor and electronics industry chain, gathering well-known industry leaders and leading enterprises to showcase cutting-edge technology new products and benchmark solutions in the field in one stop. The exhibition provides an efficient platform for exhibitors, professional visitors, and procurement teams to interact and communicate face-to-face, accelerating industrial collaborative innovation and upgrading development.

1. IC Design and Chips

Design tools and services (EDA software, IP cores, design services, embedded software, FPGA/ASIC design, IC layout design); CPU/GPU, AI chip, storage chip, communication/RF chip MCU、 Sensor chips, power chips, automotive grade chips, display driver chips, MEMS chips; Fabless/ODM/Foundry (fabless, integrated device manufacturer, wafer foundry services).

2. Semiconductor manufacturing equipment and core components

Lithography machine, etching machine, thin film deposition (CVD/PVD/ALD), ion implantation, oxidation/diffusion, cleaning equipment CMP、 Annealing/heat treatment, single crystal furnace, slicing/grinding/polishing/thinning, slicing/cutting, epitaxial growth equipment), measurement and testing (optical/electron beam measurement, defect detection, film thickness/stress/resistivity testing, wafer probe station, RF power supply, electrostatic suction cup (ESC), precision pump valve, flow meter, quartz/ceramic/silicon components, precision motion system, robot, clean room matching, etc.

3. Semiconductor materials

Silicon wafer (8/12 inches) SOI、 Sapphire, silicon carbide (SiC), gallium nitride (GaN), diamond, gallium arsenide (GaAs), photomask, photoresist and supporting reagents, electronic specialty gases, wet electronic chemicals, CMP polishing solution/pad, sputtering target material, photoresist remover, developer, packaging substrate (organic/ceramic/glass), lead frame, bonding wire, plastic packaging material, bottom filling adhesive, solder, thermal interface material, powder metallurgy, advanced ceramics, etc.

4. Encapsulation testing

WLP、SiP、2.5D/3D、TSV、Chip let 、Fan-out、 Inverted, bump, panel level packaging, die bonding machine, wire bonding machine, plastic packaging machine, cutting/forming, testing machine, sorting machine, aging equipment, AOI testing, OSAT manufacturer, testing plan, reliability verification, failure analysis, etc.

5. Compound/Third Generation Semiconductor

SiC、GaN、GaAs、InP、ZnO、 Diamond, aluminum nitride, power devices, RF devices, optoelectronics LED、 Laser, detector, specialized equipment, epitaxy, substrate, packaging solution, etc.

6. Electronic intelligent manufacturing

SMT technology and equipment, smart factories in the electronics industry, testing and measurement, PCB and circuit carrier manufacturing, connector and wire harness processing, electronic components, electronic and chemical materials, etc.

7. New generation electronic information technology

Next generation communication networks, Internet of Things, triple play, cloud computing, etc.

8. Semiconductor chips and device applications

Display and application, 3D glass, touch screen module, automotive electronics, 5G/communication, AI computing power, data center, new energy, industrial control, consumer electronics, medical electronics, aerospace, etc.

　　What high-end activities can I participate in during the same period?

The exhibition will hold multiple in-depth industry linkage conferences and activities at the same time, covering the hot topics of the entire industry chain from materials, design, manufacturing, packaging and testing to terminal applications. By inviting industry experts to jointly create an efficient interactive platform for one-stop technical exchange and supply and demand cooperation, we aim to expand the resources of the semiconductor and new energy vehicle track and seize industry window opportunities.

We will integrate high-quality industry resources, gather targeted audiences through multiple channels such as precise online coverage, offline visits and invitations, and collaboration with organizational partners, allowing more enterprises to seize professional technical exchange opportunities, understand the latest industry trends, expand network resources, update technical products, and jointly build an open industry interactive ecosystem.

1. Communication and smartphones PC、 Leaders of terminal application enterprises such as tablet computers, intelligent automotive industry, medical, 3C, laptops, and consumer electronics.

2. Senior leaders and technical leaders of upstream and downstream enterprises in the semiconductor industry, including integrated circuit design, manufacturing, packaging and testing, semiconductor materials, and equipment.

3. Senior leaders and technical leaders of terminal application enterprises in low altitude economy, aerospace economy, aerospace, national defense and military industry, radar, medical, photovoltaic, optical communication, optical modules, etc.

4. Executives from enterprises such as 5G applications, big data, the Internet of Things, intelligent automotive networking, intelligent driving, automotive electronics, vehicle and automotive parts factories, and lithium batteries.

5. Representatives from government departments, industry associations/societies, and research institutes; Mainstream/professional media professionals and semiconductor investors.

September 20-23, 2026

Looking forward to meeting in Hefei and seizing industry opportunities

Pre lock the golden booth

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2026 Semiconductor Industry and Electronic Technology (Hefei) Exhibition

Exhibition: Han Long 151-1199-9807

Attendee: Jiangling 188-8319-1601

Visit: Han Shuyuan 188-7515-7024

Media: Ms. Hu 191-2204-3870