HS-IPCE - IP Circuit Simulator

There are two different encapsulation methods to choose from: simple Ethernet encapsulation or UDP/IP protocol encapsulation. The former is suitable for interconnection within the same Ethernet subnet, as it has high encapsulation efficiency and is particularly suitable for bandwidth tight situations, such as interconnection for wireless bridges, but cannot cross routers. The latter is used for interconnection within IP networks, with the advantage of being able to utilize routers or layer 3 switches. The disadvantage of crossing Ethernet segments is that the additional IP header requires extra bandwidth. When using 128 byte encapsulation, each E1 channel occupies approximately 500kbps more bandwidth than the simple Ethernet encapsulation method, resulting in lower transmission efficiency. Users can choose their own encapsulation mode according to the actual application scenario.

• Transparent transmission of framed, unframed E1, and framed E1 (N * 64K) signals over IP networks, in compliance with G.703 regulations;
• High transmission efficiency, low transmission delay;
• Provide 4 E1 circuits and 2 10/100Base Tx downlink ports, universal RJ45 Ethernet interface, 10M/100M adaptive;
• Ethernet packet length can be set, supporting long packets;
• Users can choose between IP protocol encapsulation or pure Ethernet encapsulation;
• Support VLAN configuration;
• Point to point and point to multipoint connections to meet different application needs;
• High transmission efficiency, up to 90% bandwidth utilization efficiency;
• Supports both 75 Ω and 120 Ω types of interfaces simultaneously, without the need for configuration;
• Ethernet interface 10/100M adaptive, full/half duplex adaptive, cross/straight line adaptive;
• When selecting a network adaptation clock, the TDM clock recovery mechanism can accurately recover the original clock, ensuring clock stability with minimal jitter and drift, in compliance with ITU-T clock jitter and drift standards.