The FJ-5 research grade metallographic microscope is developed for the needs of the semiconductor industry, silicon wafer manufacturing industry, electronic information industry, and metallurgical industry. As a metallographic microscope user, it can experience its superior performance and can be widely used in semiconductors FPD、 Testing of circuit packaging, circuit substrates, materials, castings/metal/ceramic components, and precision molds
product details
The FJ-5 research grade metallographic microscope is developed for the needs of the semiconductor industry, silicon wafer manufacturing industry, electronic information industry, and metallurgical industry. As a metallographic microscope user, it can experience its superior performance and can be widely used in semiconductors FPD、 Inspection of circuit packaging, circuit substrates, materials, castings/metal/ceramic components, and precision molds. This instrument adopts two forms of illumination: reflection and transmission. Under the illumination of reflected light, it can perform bright and dark field observation, DIC observation, and polarization observation. Observe the bright field under transmitted light. A stable and high-quality optical system provides clearer imaging and better contrast. A design that meets ergonomic requirements, making you feel comfortable and relaxed at work.
Characteristic Description
1. The objective imaging technology adopts the UIS high-resolution and long working distance optical path correction system.
2. Expanded the reuse technology of the objective lens, and the far objective lens is compatible with all observation methods including bright and dark field of view, polarization, DIC, and provides high-definition image quality in each observation method.
3. Use non spherical Kohler illumination to increase observation brightness.
4. WF10 × (Φ 25) ultra large field eyepiece, long working distance bright and dark field metallographic objective.
5. A converter that can be plugged into a DIC differential interference device.
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technical specifications
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viewing head
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30 ° hinge type three mesh (50mm-75mm)
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eyepiece
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WF10×/25mm
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WF10 ×/20mm, with 0.1mm cross dividing plate
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objective
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Long distance work on a flat field Distance from light and dark field objective lenses: 5 ×/0.1B.D/W.D.29.4mm, 10 ×/0.25B.D/W.D. 16mm, 20 ×/0.40B.D/W.D. 10.6mm, 40 ×/0.60B.D/W.D. 5.4mm
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converter
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Four hole converter with DIC jack
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platform
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Double layered mobile platform
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Platform size: 189mm × 160mm
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Mobile range: 80mm × 50mm
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Filter
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Plug in color filter (green, blue, neutral)
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condenser
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N. A.1.25 Abbe condenser with variable aperture and color filter
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focus adjustment
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Coarse and micro coaxial focusing, using a gear rack transmission mechanism Micro grid value 0.002mm
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light source
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Transmitting lighting: halogen lamp 12V/50W, AC85V-230V, adjustable brightness
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Falling light illumination: with aperture light bar and field of view light bar, halogen lamp 12V/50W, AC85V-230V, adjustable brightness
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Polarizing device
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The analyzer can rotate 360 degrees, and both the polarizer and analyzer can be moved out of the optical path
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Testing tools
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0.01mm measuring ruler
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Available as attachments
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Two dimensional measurement software
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Professional metallographic image analysis software
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Falling light illumination: halogen lamp 12V/100W, AC85V-230V, adjustable brightness
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Flat field long working distance bright and dark field objective lenses: 50 ×/0.55B. D/W.D. 5.1mm, 80 ×/0.75B. D/W.D. 4mm, 100 ×/0.80B. D/W.D. 3mm
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micrometer eyepiece
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1.3 million, 2 million, 3 million, and 5 million pixel CMOS electronic eyepieces
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Photography device and CCD interface 0.5 ×, 0.57 ×, 0.75 ×
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DIC (10 x, 20 x, 40 x, 100 x)
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press
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Color 1/3-inch CCD 520 lines
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