IGBT Vacuum Eutectic Furnace V8L

Introduction to IGBT Vacuum Eutectic Furnace V8L:
1. Significantly reduce the welding bubbles in the solder, reducing the void rate to 1-2%.
2. Improve the electrical performance and welding joints of the product, effectively improving the reliability and welding quality of the welding points.
3. Can be used for double-sided soldering of PCBs, suitable for mass production, and can be continuously put into production lines. The average production cycle is controlled within 30-60 seconds.
4. Vacuum degree, vacuum holding time, deflation time, vacuum pumping rate, etc. can be freely set.
5. It can complete the soldering of circuit boards with aluminum heat sinks installed.
6. Low power consumption and high insulation design with environmental protection as the concept. The temperature of the shell shall not exceed 40 degrees.
7. EfficiencytallA high-capacity flux recycling device.
8. Use integrated oxygen sensor technology to ensure precise control of oxygen content and real-time/continuous monitoring of residual oxygen content in the furnace.
9. The device can also be used as a regular nitrogen or air furnace.

model	V8L
Heating temperature zone	8
Vacuum zone	1 (optional)
cooling zone	2
heating temperature	280-320 degrees (350 degrees optional)
真空度	0.5-5Kpa
Nitrogen consumption	300-500L/min
oxygen analyzer	1 standard configuration
Highest component height	30mm
PCB width	100-250mm (optional for sizes above 250mm)
PCB length	100-350mm
orbital altitude	850-950mm
Flux recycling	Water cooling recycling system
Hot air speed adjustment	Infinite frequency conversion adjustment
cooling method	Water cooling, equipped with industrial chillers
power supply	380V/220V
Overall dimensions	5800L*1500W*1600H
weight	2800kg