IGBT vacuum reflow soldering H5/H6

2. Heating system: The equipment is equipped with 5/6 sets of heating systems and operates in a vacuum environment.
3. Vacuum system: The equipment is equipped with a directly connected high-speed rotary vane vacuum pump, which can quickly achieve a high vacuum environment of 0.1mbar in the furnace chamber, with a maximum vacuum degree of 0.01mbar.
4. Cooling system: The equipment adopts a water cooling system to ensure rapid cooling in a high-temperature vacuum environment.
5. Software system: Temperature rise and fall programmable control, temperature rise and fall curves can be set according to the process, and each curve can be automatically generated, edited, modified, stored, etc.
6. Control system: Software modular design can independently set process curves, vacuum extraction, atmosphere, cooling, etc., and can merge production processes to achieve one click operation.
7. Atmosphere system: The equipment realizes the welding of helpless flux and can be filled with reducing or protective gases such as H2, N2/H2 mixed gas, HCOOH, N2, etc., to ensure that the solder joints are free of voids.
8. Data recording system: equipped with uninterrupted real-time monitoring and data recording system, software curve recording, temperature control curve saving, process parameter saving, equipment parameter recording, and calling.
9. Protection system: eight system safety status monitoring and safety protection designs (welding over temperature protection, whole machine temperature safety protection, low and high air pressure alarm protection, water pressure protection, safety operation protection, cooling water circuit protection during welding, liquid level protection, power outage protection).

Features:

1. High vacuum degree: 0.01mbar high vacuum, real-time display of chamber vacuum degree value, and controllable and adjustable
2. Vacuum pumping speed, 50 m ³/h
3. Process chamber pressure: 0.1mbar
4. Heating plate partition load-bearing capacity, single-layer load-bearing capacity ≥ 20 kilograms
5. Rapid cooling speed: Independent water and gas cooling devices are installed in the chamber to achieve rapid cooling of the welded components.
6. Welding quality with low porosity: Ensure that after welding, large-area solder pads achieve a porosity of less than 3%
7. It can meet the high-temperature welding requirements of materials such as gold solder pads, high lead solder, lead-free solder paste, and the technical requirements for high-quality welding in solder paste vacuum environment.
　　8. High production capacity: The actual welding area of each layer is 500 * 300mm, and multiple layers work simultaneously to achieve large-scale production of devices.

IGBT vacuum reflow soldering technical parameters:

Model number	H5	H6
Welding area	500 * 300 * 70mm * 5 layers	500 * 300 * 70mm * 6 layers
Furnace height	70mm
single-layer load-bearing	20KG
maximum temperature	350℃ — 450℃
control system	Temperature control system+vacuum system+cooling system+atmosphere system+software control system
Control method	Brand industrial computer+software system
temperature curve	40 segment temperature control
rated power	70KW	80KW
Actual Power	55KW	65KW
weight	1200KG	1250KG
真 空 度	0.1mbar/0.0001mbar
temperature range	Room temperature -450 ℃
Maximum heating rate	≥70℃/min
Maximum cooling rate	≥120℃/min
Atmosphere restoration	Nitrogen hydrogen mixture, pure hydrogen, nitrogen and other inert gases, as well as formic acid
Cold water system	>100L/min， Outlet temperature: 5-10 ℃
Power supply	380V 50-60A
Overall dimensions	1600*1000*1800mm

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