Kejing Five Target Head Plasma RF Magnetron Sputtering Instrument

KejingFive target plasma RF magnetron sputtering instrument

Model:VTC-5RF

Product Overview:

VTC-5RF is a plasma RF magnetron sputtering instrument with 5 targets, designed for the research of high-throughput MGI (Materials Genome Project) thin films. Specially suitable for exploring solid-state electrolyte materials, combining 5 elements in 16 different ratios.

Key Features:

• Multiple sputtering targets and power supplies are available for free combination. Please contact our sales department for more details.
• Depending on the power source used (DC or RF), metal or non-metal materials can be deposited.
• A rotary switch can sequentially activate the sputtering head and automatically switch between vacuum or plasma environments without affecting the vacuum degree.
• Five different materials of target materials can be installed, and each target head can be individually set with parameters such as sputtering time and power for growing thin films of different compositions.
• Multiple RF power supplies can be selected to sputter multiple target materials at the same time.
• Optional equipment control software can be used to control all parameters of sputtering with a computer.

Sputtering chamber：

• The vacuum chamber is made of 304 stainless steel
• Internal dimensions of the cavity: 470mm L × 445mm D × 522mm H (105 L)
• Hinged chamber door with a diameter of Φ 380mm and a glass window of Φ 150mm installed on top

Sputtering head&sample stage：

• 5 1-inch magnetron sputtering heads with water-cooled interlayer
• An electric baffle is installed inside the sputtering chamber
• Sputtering distance: Sputtering distance adjustable
• Sputtering angle: The sputtering angle can be adjusted
• During the experiment, it is necessary to bond the target material and the copper gasket of the target material with conductive silver paste (which can be purchased from our company)
• RF connection cables can be ordered separately as backup
• The equipment requires a water chiller for cooling the target head

sample stage：

• A sample stage with a diameter of 150mm, covered with a rotating stage with a 10mm hole, exposing one sample at a time for sputtering film formation.
• Sample table size: Φ 150mm, can be rotated through program control, can produce 16 different components of thin films
• The sample stage can be heated,zuiThe high temperature can reach up to 600 ℃ (may vary depending on the configuration, please consult the sales department for details)

vacuum system：

• Installed with KF40 vacuum interface
• Vacuum degree: 4.0e-5 Torr (molecular pump) (reference value, please click for details)
• Various vacuum pumps can be purchased from our company

intake：

• Equipped with a 1/4 inch air inlet on the device for easy connection to gas cylinders
• There is an airflow adjustment knob installed on the front panel of the device for easy adjustment of airflow

target material：

• Required target size: diameter of 25mm,zuiLarge thickness 3mm
• You can purchase various target materials in our company

KejingFive target plasma RF magnetron sputtering instrument

Model:VTC-5RF

Thin film thickness gauge(Optional):You can purchase a thin film thickness gauge from our company and install it on the sputtering instrument

Net weight:60Kg (excluding pump)

Quality certification:CE Certification

Usage tips:

• This device is a DIY device with significant parameter changes. Please make sure to communicate carefully over the phone before purchasing
• In order to achieve better film quality, high-purity gas (recommended>5N) must be introduced
• Before sputtering coating, ensure the cleanliness of the sputtering head, target material, substrate, and sample stage
• To achieve good adhesion between the film and the substrate, please clean the surface of the substrate before sputtering
• Ultrasonic cleaning (detailed parameters click on the image below): (1) Acetone ultrasonic (2) Isopropanol ultrasonic - remove oil (3) Blow nitrogen drying (4) Vacuum oven to remove moisture.
• Plasma cleaning (click on the image below for detailed parameters): can roughen the surface, activate surface chemical bonds, and remove additional pollutants.
• Manufacturing a thin buffer layer (about 5 nanometers) such as Gr, Ti, Mo, Ta can be applied to improve the adhesion of metals and alloys.

Warning：

• Attention: There are high-voltage components installed inside the product. It is prohibited to disassemble or move the body with electricity without authorization.
• A pressure reducing valve (not included as standard equipment) should be installed on the gas cylinder to ensure that the output pressure of the gas is limited to 0.02 megapascalsBelow, for safe use.
• The sputtering head is connected to a high voltage. For safety reasons, the operator must install samples and replace targets before shutting down the equipment