Laboratory vacuum reflow soldering RS110

1. Laboratory vacuum reflow soldering is the third generation of small devices launched by Comrade TechnologyVacuum reflow solderingEquipment. A small vacuum reflow soldering equipment designed specifically for small batch production, research and development design, functional material testing, and other applications.
Laboratory vacuum reflow soldering is heated in a vacuum environment to achieve cavity free solder joints, which can meet the testing and small-scale production requirements of the R&D department.
Laboratory vacuum reflow soldering can reduce the cavity range in the soldering area of the device to 2%, while the range of ordinary reflow soldering is around 20%.
Laboratory vacuum reflow soldering can be applied to flux free soldering, with no hollow solder joints, and can be used in various atmospheres such as N2, N2/H2 95%/5%.
Laboratory vacuum reflow soldering can be performed using lead-free solder paste or solder pads, as well as using non soldering flux technology.
The laboratory vacuum reflow soldering software control system is easy to operate and can directly control equipment and set various welding process curves, and modify and create them according to different processes.
2. The RS series vacuum reflow is mainly aimed at some highly demanding welding fields, such as military products and industrial grade high reliability products. Even nitrogen protection or gas-phase welding cannot meet the reliability requirements of the products. For welding requirements of high reliability in circuits such as material testing, chip packaging, power equipment, automotive products, train control, aerospace, aviation systems, etc., it is necessary to reduce the voids and oxidation of welding materials. How to effectively reduce the void rate, minimize the oxidation of solder pads or component pins, and make vacuum reflow soldering the ideal choice. To achieve high welding quality, a vacuum reflow soldering machine is used. This is an innovative welding process in the military industry of countries such as Germany, Japan, and the United States.
3. Industry application: The RS series vacuum reflow soldering machine is an ideal choice for R&D, process research and development, material testing, and device packaging testing. It is also an ideal choice for research and production in military enterprises, research institutes, universities, aerospace and other fields.
4. Application areas: Mainly used for defect free welding of chips and substrates, shells and covers, and for welding of helpless solder flux, such as IGBT packaging, solder paste process, laser diode packaging process, hybrid integrated circuit packaging, shell and cover packaging, MEMS and vacuum packaging.
5. Vacuum reflow soldering has become a choice for military enterprises, aviation, aerospace and other manufacturing industries in developed countries such as Europe and America, and has been widely used in fields such as chip packaging and electronic soldering.

[Features]
1. Welding in a true vacuum environment. Vacuum<5Pa（10^-3PaOptional)
2. Welding environment with low activity flux.
3. Professional software control to achieve a good operating experience.
4. A programmable temperature control system with up to 40 segments in the industry, capable of setting process curves.
5. The temperature setting can be adjusted to set a process that is closer to the welding material process curve.
6. Water cooling technology, achieving rapid cooling effect (standard).
7. Online temperature measurement function. Accurate measurement of temperature uniformity in the welding area. Provide support for process tuning.
8. Nitrogen or other inert gases meet the welding requirements of special processes.
9. The maximum temperature is 400 ℃ (higher optional), meeting all the requirements of soft soldering processes.
10. Five system safety status monitoring and safety protection design (welding over temperature protection, whole machine temperature safety protection, safety operation protection, cooling water circuit protection during welding, power outage protection).


1. One host
2. One industrial grade control computer
3. One set of temperature control software
4. One set of temperature controller
5. One set of pressure controller
6. One set of inert gas or nitrogen control valves

[Optional]
1. Corrosion resistant diaphragm pump, vacuum 10mba
2. Rotary vane pump, vacuum less than 5Pa
3. Vortex molecular pump system, used for 10^-3Pa's vacuum
4. Hydrogen type and hydrogen safety device
5. High temperature module (500 degrees high temperature)


Model: RS110
Welding area: 110mm * 110mm
Furnace height: 40mm (other heights are optional)
Temperature range: up to 400 ℃
Interface: Serial port 485 network/USB
Control mode: 40 stage temperature control+vacuum pressure control
Temperature curve: can store several 40 segment temperature curves
Voltage: 220V 25A
Rated power: 9KW
Actual power: 6KW (vacuum pump not selected); 8KW (prepared molecular pump)
Dimensions: 450 * 450 * 1300mm
Weight: 210KG
Maximum heating rate: 120/min
Maximum cooling rate: 80k/min
Cooling method: air-cooled/water-cooled