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Suzhou Micro Electronic Technology Co., Ltd
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Suzhou Micro Electronic Technology Co., Ltd

  • E-mail

    szrek@163.com

  • Phone

    13962658505

  • Address

    180 Kaiping Road, Wujiang District, Suzhou City

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Line light source type UV LED curing device

NegotiableUpdate on 02/15
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Overview
UV LED line light sources have shown significant advantages in replacing traditional UV mercury lamps, providing better choices for cost savings and process improvement. The UV LED line light source curing device HFDX-1300-8U adopts world leading heat dissipation technology, greatly reducing the heat loss caused by heat generation to the product, effectively extending the service life of the UV LED line light source, up to 30000 hours. Due to the use of LED chips as the light source, a cold light source is generated without thermal radiation, effectively reducing the heat generated during the curing process; Higher luminous efficiency and lower power consumption, compared to traditional UV mercury lamps, UV LED line light sources save about 5.6 times more energy than traditional UV mercury lamps.
Product Details
  • UV LED line light sourceSignificant advantages have been demonstrated in replacing traditional UV mercury lamps, providing better options for cost savings and process improvement.UV LED line light source curing device HFDX-1300-8UBy adopting world leading heat dissipation technology, the heat loss caused by heat generation on the product is greatly reduced, effectively extending the service life of UV LED line light sources, up to 30000 hours. Due to the use of LED chips as the light source, a cold light source is generated without thermal radiation, effectively reducing the heat generated during the curing process; Higher luminous efficiency and lower power consumption, compared to traditional UV mercury lamps, UV LED line light sources save about 5.6 times more energy than traditional UV mercury lamps.

  • ● Optical industry
    Lens bonding and assembly of lens groups, prisms, and optical engines.
    Microscope, endoscope, infrared device, night vision device, probe assembly, etc.

    ● Optical communication industry
    Passive component bonding (bonding or encapsulation of various glass packaging structures, fixing of small components).
    Adhesive bonding of active devices (coaxial devices, laser collimators).

    Microelectronics and Semiconductor Industry
    LEC LCD encapsulation, pin and FPC bonding, sensor production, mobile phone component assembly, hard disk head assembly, motor and component assembly, precision electronic manufacturing of components (capacitors, inductors, various plugins, screws, chips, etc.).

    ● Medical industry
    Various catheter adhesives and precision instrument adhesives.

    ● Scientific research
    Photocatalysis, photoexcitation, photosynthesis, and various scientific research experiments.

    Printing industry
    UV ink drying and curing for flat printing, photo printing, inkjet printing, trademark printing, screen printing, etc.

  • Specification and model Illumination area
    (LxW)(mm)
    Optical power (mW/cm2) Recommended irradiation distance (mm) Wavelength (nm) Service life (H) Cooling method
    HFD*-T5(8/10)-25 T5(8/10)*25 1800 - 2800 Working distance of T5: 15mm
    Working distance of T8 and T10: 5mm or more
    365nm
    375nm
    385nm
    395nm
    405nm
    20000 - 40000 Air cooling/water cooling
    HFD*-T5(8/10)-50 T5(8/10)*50 1800 - 2800
    HFD*-T5(8/10)-100 T5(8/10)*100 1800 - 2800
    HFD*-T5(8/10)-120 T5(8/10)*120 1800 - 2800
    HFD*-T5(8/10)-200 T5(8/10)*200 1800 - 2800
    HFD*-T5(8/10)-250 T5(8/10)*250 1800 - 2800
    HFD*-T5(8/10)-300 T5(8/10)*300 1800 - 2800
    HFD*-T5(8/10)-350 T5(8/10)*350 1800 - 2800
    HFD*-T5(8/10)-500 T5(8/10)*500 1800 - 2800
    HFD*-T5(8/10)-600 T5(8/10)*600 1800 - 2800
    HFD*-T5(8/10)-800 T5(8/10)*800 1800 - 2800
    HFD*-T5(8/10)-1300 T5(8/10)*1300 1800 - 2800

    Note: (*) represents: "X" represents: 365nm; "Y" represents: 395nm; "O" represents: 405nm; adding "S" before F is water-cooled;