MARUEI Marurong Mechanical Composite Grinding Disc 2HG-100

MARUEI Marurong Mechanical Composite Grinding Disc 2HG-100

MARUEI Marurong Mechanical Composite Grinding Disc 2HG-100

Composite grinding disc 2HG-100

Tower wheel type composite grinding disc UMG-200, UMG-450

Characteristics of the 2HG-100 2-head cylindrical grinding disc:

By equipping two grinding machines, multi-stage machining can be achieved under single clamping

The function of cylindrical grinding disc:

Cylindrical grinding disc is a special grinding tool mainly used for polishing metal or non-metal plates, especially in the processing of printed circuit boards (PCBs), which has important applications. The design of this grinding disc enables it to uniformly polish or polish large surface objects while rotating at high speed, and can also closely adhere to the surface of objects with large surface undulations for treatment.

Structural features:

Cylindrical grinding discs are usually composed of rigid cylindrical tubes, with multiple support bodies with through holes on their outer surfaces. On the outer surface of the support, wrap the solid at a right angle to the centerline. After continuously arranging and fixing multiple grinding stone fragments on the surface of the elastic plate, the elastic plate is wrapped and attached to the outer surface of the reinforcement body. This structural design ensures that the internal solid and support body of the grinding brush have uniform deformation and support force during high-speed rotation.

Application Scenario:

Cylindrical grinding discs are suitable for uniformly grinding or polishing large surface objects, as well as objects with large surface undulations. Due to its ability to closely adhere to the surface of objects for processing, it can also be used as a leveling roller for flat plates. The application of this grinding disc in PCB processing reflects its importance in the electronic manufacturing industry, ensuring the flatness and smoothness of the circuit board surface, which is crucial for subsequent soldering and other process steps.