The semiconductor Showerhead, also known as the spray head, gas distribution disk, or uniform gas disk in Chinese, is a core component in semiconductor manufacturing equipment and plays a critical role in the semiconductor production process. Can be applied to semiconductor pre-processing equipment such as ETCH, CVD, etc. Can provide higher process consistency, stability, and repeatability.
Metal componentsShowerhead Chinese nameSprinkler head, gas distribution plate or homogenization plate
The semiconductor Showerhead, also known as the spray head, gas distribution disk, or uniform gas disk in Chinese, is a core component in semiconductor manufacturing equipment and plays a critical role in the semiconductor production process12Here is a detailed introduction about it:
structural design
Microporous structureThe surface of the semiconductor Showerhead is covered with hundreds or thousands of tiny through holes, typically ranging in size from 0.2-6mm. The size, distribution, shape, and spray angle of these micropores are precisely designed according to the specific process to ensure that the gas can be evenly distributed into the reaction chamber2.
gas passageThere is a complex gas channel structure inside, which is used to guide and distribute different gases, so that they can be fully mixed and evenly distributed before reaching the reaction chamber, to meet the precise requirements of semiconductor processes for gas flow rate and concentration.
Material Classification1
Metal ShowerheadMaterials include aluminum alloy, stainless steel, nickel metal, etc. Among them, aluminum alloy is a widely used material because it has good thermal conductivity, strong corrosion resistance, wide sources, and is easy to process.
Non metallic ShowerheadMaterials include silicon carbide (CVD SiC), monocrystalline silicon, quartz glass, and high-purity ceramics, which are mainly used in key process positions of chip processing equipment. The consistency requirements for materials and processed parts, especially holes, are high.
function and role
Uniform distribution of gasSpray various process gases evenly onto the surface of the wafer in the reaction chamber to ensure that different areas of the wafer can be uniformly "bathed" in the process gases, thereby improving production efficiency and product quality, and ensuring the uniformity and consistency of the deposited film layer2.
Participate in chemical reactionsIn processes such as chemical vapor deposition (CVD), Showerhead mixes different precursor gases and sprays them onto the substrate surface to undergo chemical reactions under certain conditions, forming the desired thin films such as silicon oxide, polycrystalline silicon, metal oxide, etc2.
Control reaction environmentUsed to control the atmosphere and temperature inside the reaction chamber, provide precise gas mixture, and generate uniform gas at the desired location, ensuring uniform gas distribution inside the reaction chamber and achieving stable deposition process2.
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Form a uniform electric fieldIn plasma assisted processes such as PECVD and dry etching, the Showerhead serves as a part of the electrode and generates a uniform electric field through a radio frequency power source to promote the uniform distribution of plasma, thereby improving the uniformity of etching or deposition2.
Application field
etching processIn etching equipment, Showerhead is used to precisely control the flow and distribution of etching gas, ensuring precise etching of the wafer surface to form the desired circuit patterns and structures4.
Sedimentation processShowerhead uniformly delivers precursor gases of deposited materials to the wafer surface, such as chemical vapor deposition (CVD), physical vapor deposition (PVD), etc., to achieve the growth and deposition of thin films2.
cleaning processIn semiconductor cleaning equipment, Showerhead can evenly spray cleaning solution or gas onto the surface of the wafer to remove impurities and pollutants, ensuring the cleanliness of the wafer.
