Silicon wafer hot stage RT400XRD

Temperature range: Room temperature to 400 ℃

Heating platform: 200mm in diameter

Plane incidence angle: -40 °≤α ≤ 40 °, ray vertical incidence angle: -2 °≤β ≤ 70 °

Heating rate<5 ℃/min

Main temperature measurement: thermocouple, infrared temperature measurement (auxiliary)

Temperature display/control accuracy: 0.1 ℃/0.5 ℃

Experimental environment: The chamber is sealed and can be filled with atmosphere

Cooling method: circulating water cooling

Temperature control: regulator accuracy level 0.2, PID artificial intelligence control, 50 segment program

Temperature control software: interface switching between Chinese and English, real-time control, multi-point temperature correction, adjustable temperature speed, temperature control range, etc., process curve display and recording

Motion controller: One axis hot table moves horizontally, one axis hot table rotates, and one axis infrared temperature measurement moves. Manual or software control.