Thermo Fisher Scientific Termofisher

FEI is a leading enterprise in the industry that produces and operates various scientific instruments. Its products include electron and ion beam microscopes, as well as related products that can meet the nanoscale applications of multiple industries spanning industrial and theoretical materials research, life sciences, semiconductors, data storage, natural resources, and many other fields.
Provide world-class microscopy solutions for the global nanotechnology community.
With a 60 year history of technological innovation and industry leadership, FEI has become a leader in transmission electron microscopy (TEM), scanning electron microscopy (SEM), and DualBeam that integrates SEM with focused ion beam (FIB) ™ Performance standards for instruments and specialized focused ion beam instruments used for precision high-speed cutting and processing. The FEI imaging system has achieved sub angstrom (angstrom: one tenth of a nanometer) resolution in the fields of 3D characterization, analysis, and modification/prototyping.
FEI NanoPorts has established centers of excellence in Shanghai, China, Portland, Oregon, USA, Tokyo, Japan, Eindhoven, Netherlands, and Czech Republic. Here, numerous scientists, researchers, and engineers can experience world-class microscopic resolution with the direct assistance of FEI application experts. Our company has nearly 1800 employees and has conducted sales and service operations in over 50 countries or regions worldwide.
Scanning Electron Microscope (SEM)
The magnification range of scanning electron microscopy can be extended from the observation scale of optical microscopy to the nanoscale, making it a suitable choice for examining material morphology. FEI scanning electron microscope (SEM) scans the surface of the sample with a precisely focused electron beam, and then detects the results of the electron beam sample interaction using various detectors to generate images. FEI SEM can operate in both high and low vacuum modes, using secondary electron detectors that provide surface information, backscatter detectors that provide composition information, and various other detectors.
Magellan ™ XHR scanning electron microscope
The Magellan XHR scanning electron microscope (SEM) allows scientists and engineers to quickly see microscopic worlds that were previously inaccessible, such as three-dimensional surface images at different angles with a resolution of less than one nanometer (approximately the diameter of 10 hydrogen atoms). Most importantly, Magellan XHR SEM can image at ultra-low electron beam energy, avoiding image distortion caused by electron beam penetration below the material surface.
Quanta ™ scanning electron microscope
Quanta scanning electron microscope is a high-performance multifunctional electron microscope that offers three operating modes (high vacuum, low vacuum, and ring scanning (ESEM)). It is the scanning electron microscope that can see the most types of samples among all scanning electron microscopes. All Quanta SEM systems are equipped with analysis systems such as energy spectrometers, X-ray spectrometers, and electron backscatter diffraction analysis systems. In addition, the field emission (FEG) system is equipped with scanning transmission (S/TEM) detectors to achieve bright and dark field sample imaging.
Nova ™ NanoSEM scanning electron microscope
The Nova series scanning electron microscope (SEM) has low vacuum function. The Nova system includes EBIC, frozen sample stage, STEM, EDS, WDS, and EBSD.
Inspect ™ scanning electron microscope
The Inspect series has two scanning electron microscopes, one using tungsten filament and the other using FEG, both of which can be used for conventional high-resolution imaging.
Transmission Electron Microscope (TEM)
FEI transmission electron microscope (TEM) can achieve fully integrated automated operation, suitable for various applications requiring sub angstrom ultra-high resolution. Transmission electron microscopy uses an electron beam to irradiate ultra-thin (0.5 µ m or smaller) samples. By detecting the electrons that penetrate the sample and reach the electromagnetic lens system, images can be recorded. This electromagnetic lens system can focus and magnify the images onto fluorescent screens, photosensitive films, or digital cameras. The magnification of transmission electron microscopy can reach over one million times.
Titan ™ Scanning/Transmission Electron Microscope
The FEI Titan S/TEM product line includes the world's most powerful commercial S/TEMs: Titan 80-300, Titan Krios ™、 Titan3 ™ And Titan ETEM (Environmental TEM). All Titans use revolutionary 80-300 kV electron tubes for sub angstrom atomic scale discovery and exploration through TEM and STEM modes under various materials and operating conditions.
Tecnai ™ transmission electron microscope
The Tecnai series transmission electron microscopes are designed to meet the high contrast imaging needs of materials science, life science and soft matter research, semiconductor and data storage industries, as well as top multi-user laboratories around the world.
DualBeam ™ Instrument (FIB/SEM)
Combining focused ion beam and scanning electron microscope.
FEI's Dual Beam instrument combines the milling function of a focused ion beam tool with the imaging capability and resolution of a scanning electron microscope. These cutting-edge instruments are the preferred solutions for 3D microscopy and material characterization analysis, industrial fault analysis, and process control applications. These instruments are designed to provide integrated sample preparation and 1nm scale microanalysis for the high-yield semiconductor and data storage manufacturing industries, as well as materials science and life science laboratories.
Quanta ™ 3D DualBeam ™
It is suitable for the characterization and analysis of two-dimensional and three-dimensional materials. Quanta ™ 3D has three SEM imaging modes (high vacuum, low vacuum, and environmental SEM), and the samples it can observe are the most widely available in any SEM system. The integrated focused ion beam (FIB) function increases the cross-sectional operational capability, further expanding the application range. The ESEM mode enables in-situ study of various material dynamic behaviors under different relative humidity (up to 100%) and temperature (up to 1500 ° C) conditions.
Helios NanoLab ™ DualBeam ™
Helios NanoLab has excellent imaging capabilities due to its new electron beam tube, which is equipped with a complete set of detectors and includes a new imaging chain that can generate excellent contrast and resolution. Meanwhile, the excellent performance of focused ion beam (FIB) enables rapid milling and sample preparation applications.
Versa ™ 3D DualBeam ™
With a strong historical background and the highly successful DualBeam, low vacuum, and ESEM specialized technologies pioneered by FEI, FEI has introduced the most powerful DualBeam instrument currently available. Versa 3D provides you with the best imaging and analysis performance, allowing you to obtain large amounts of 3D data even for the most challenging samples.
Focused Ion Beam (FIB) Instrument
Revealing defects beneath the surface of materials and equipment
A focused ion beam system (FIB) is a tool that is very similar to a focused electron beam system (such as a scanning electron microscope). These systems direct the ion beam towards the sample, and then the ion beam interacts to generate some signals. By mapping these signals to the position of the ion beam, high magnification sample images can be generated. The mass of focused ions is many times greater than that of electrons, so when they collide with materials, these ions will cause atoms on the surface of the material to sputter out. In addition, gaseous chemicals can be injected near the surface of the material and then deposited or selectively etched according to the material.
Vion Plasma FIB Instrument
The Vion PFIB plasma FIB is an instrument with high-precision, high-speed cutting and milling capabilities. It has the ability to selectively mill and etch the area of interest. In addition, PFIB can selectively deposit patterned conductors and insulators.
V400ACE ™ Focused ion beam instrument
The V400ACE Focused Ion Beam (FIB) system incorporates the latest developments in ion tube design, gas transport, and terminal detection technology to achieve fast, efficient, and cost-effective advanced integrated circuit editing. Circuit editing allows product designers to modify conductive paths and test modified circuits within hours, without having to spend weeks or even months generating new masks and processing new chips.
V600 ™ and V600CE ™ Focused ion beam instrument
The V600 series Focused Ion Beam (FIB) instrument provides a complete solution for general purpose editing and debugging. On the basis of successful on-site use of FEI FIB 200, V600 FIB can achieve a new generation of flexibility and performance required for effective cross-sectional manipulation, imaging, and transmission electron microscopy (TEM) sample preparation. The V400ACE Focused Ion Beam (FIB) system incorporates the latest developments in ion tube design, gas transport, and terminal detection technology to achieve fast, efficient, and cost-effective advanced integrated circuit editing at the 65 nm technology node or finer.
PRODUCT
Customized products suitable for professional applications
Vitrobot ™ Mark IV
The Vitrobot Mark IV is a fully automatic vitrification equipment suitable for quick freezing of water-based (colloidal) suspensions, which can meet the needs of modern scientific research. Its newly designed touch screen user interface is powerful and easy to use, while its automatic device ensures high-quality and repeatable sample freezing and high sample production.
MLA and QEMSCAN
QEMSCAN and MLA are professional automated mineralogical solutions that can image and quantify features closely related to commercial applications in exploration, extraction, and natural resource processing (minerals, coal, oil, and gas) in the mining and energy industries. These technologies enable bridging between meters and nanometers, which is crucial for geologists, mineralogists, and metallurgists involved in the characterization of minerals, rocks, and artificial materials.
CLM+ Full Wafer DualBeam ™
The increasing demand for high-resolution images of process control and failure analysis equipment is driving the demand for TEM imaging technology. FEI CLM+is particularly suitable for generating key TEM thin films for non in situ demolding and imaging. The Sidewinder ion tube can prepare high-yield thin films, while its excellent low-pressure performance ensures non-destructive milling and etching surfaces required for precise TEM imaging and EDS analysis. Unparalleled cutting positioning ensures accurate capture of desired target features.