USC is widely used in the display screen industry, camera module industry, LED industry, semiconductor industry, lithium battery industry, PCB/FPC and other industries. It quickly and effectively removes floating and sinking particles on the surface of products, ensuring the quality of subsequent spraying, coating, bonding, welding, packaging and other processes, greatly reducing failure rates, and improving product yield
The USC dry ultrasonic dust removal and cleaning machine is divided into 2UV and U2V types - P or C series
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Product specifications: 2UV/U2V-P/C series Technical parameters
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model
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Effective width L1 (mm)
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Inlet P
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Inhalation V
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interface
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L2(mm)
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W(mm)
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H(mm)
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Pressure (KPa)
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Flow rate (m3/h)
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Pressure (KPa)
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Flow rate (m3/h)
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Installation style
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2UV/U2V
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100
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18
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210
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-3
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230
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A/B
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300
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110
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126
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200
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18
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260
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-3
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280
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A/B
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400
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300
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18
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320
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-3
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350
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A/B
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500
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450
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18
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380
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-3
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420
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A/B
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650
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600
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18
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450
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-3
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480
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C
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800
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120
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161
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800
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18
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520
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-3
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560
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C
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1000
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1000
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18
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780
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-3
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820
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C/D
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1200
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1200
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18
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1050
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-3
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1100
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C/D
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1400
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170
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230
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1500
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18
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1380
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-3
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1430
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C/D
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1700
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1800
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18
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1600
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-3
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1650
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C/D
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2000
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2000
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18
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1830
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-3
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1880
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C/D
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2200
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Working Voltage
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380V AC
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atmospheric pressure
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10-28KPa
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Distance from dust removal unit to workpiece
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Within 5mm, it is recommended to maintain a distance of 1.5mm
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removal rate
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1.6um silicon dust 97%, 2.6um silicon dust 98%
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function
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Wind pressure monitoring, temperature monitoring, filter element monitoring, fan monitoring
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The length from the dust removal unit to the main pipe
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Within 15 meters
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outlet air temperature
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Less than 50 degrees
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Work voice
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Less than 85 decibels
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Usage environment
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Cleanroom below 10000 level; Reserved exhaust pipe: diameter 65mm
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