Fully automatic reverse packaging machine - wide width

Product features: The fully automatic reverse packaging equipment adopts reverse chip technology. Through high-precision modules, the chip is removed from the crystal disk and then cured by hot pressing with conductive adhesive to establish electrical conductivity between the chip and the antenna substrate of the coil material, thereby achieving chip and antenna packaging for electronic tags. By using a high-precision vision system for precise positioning and monitoring, the positional accuracy of chip filling and packaging is ensured. The machine integrates automatic feeding, dispensing, chip picking, filling, conveying, hot pressing curing, online detection, and material receiving.