Fully automatic solder paste printing machine P1

P1 Introduction: P1 is a fully automatic solder paste printing machine that can spray solder paste on PCBs at an instant speed

P1 Introduction:

P1 is a fully automatic solder paste printing machine that can instantly spray solder paste onto PCBs. In the production process of small batches and multiple varieties, replacing fully automatic screen printing machines to meet the demand for rapid production. Has the following advantages:

1. No template required. Reduce the waiting time for template processing, while also reducing the cost of cleaning and storing templates.

2. New product introduction is fast. Complete the production needs of small batches and multiple varieties through data import.

3. Reduce the use of solder paste. By controlling the amount of solder paste through a dedicated valve, it is generally possible to reduce solder paste waste by more than 30%.

P1 Function Introduction

1. High precision motion platform technology using integrated design and manufacturing of granite. Ensure that the P1 solder paste printing machine has been used for more than ten years with minimal changes in motion accuracy. Meanwhile, the integrated structure also has seismic resistance.

2. High speed motion system: using magnetic levitation high-precision linear motors and grating rulers imported from Europe, reducing mechanical wear and ensuring high-precision high-speed performance for long-term use of the X-axis. High speed performance up to 4M/s.

3. Visual system: Using industrial digital cameras and high-quality lenses to ensure the speed and accuracy of Mark recognition and positioning.

4. Equipped with an imported solder paste/silver paste dedicated printing device, it can achieve a minimum dispensing diameter of 0.15mm and a minimum response time of 2ms. For the solder paste process, it can be preheated from room temperature to 60 ° C to ensure the fluidity of the solder paste. The non-contact nozzle can achieve micrometer accuracy under maximum moving speed conditions, maintain highly stable solder joints, accurate solder paste volume, and ultimately meet the solder paste printing requirements of almost all SMD components such as 0201.

5. Intelligent circuit board transmission system, automatic width adjustment and clamping plate. Complete your automated intelligent production.

6. It is very convenient to import CAD files and Gerber files, which basically include all common formats.

7. Through modular design, it is easy to go upstairs through elevators without the need to demolish walls or smash windows, meeting the usage environment of office buildings such as laboratories and pilot centers.

8. Configuring different specialized printing devices can meet the different needs of solder paste and silver paste.

Temrui's factories around the world have established quality management systems and environmental management systems, and have obtained international certifications of ISO9001:2008 and ISO14001:2008.

Standard configuration:

1. One set of industrial computer

2. A set of specialized solder paste printing device

3. A set of control system for solder paste special printing device

4. One nozzle

5. A set of solder paste buckets

6. A set of Mark point recognition system

Optional:

1. Silver paste dedicated printing device

2. Nozzle

3. Industrial air pump

P1 Product Technical Parameters

1	Maximum size of substrate	350mm×350mm
2	Minimum size of substrate	50mm×50mm
3	Maximum Z-axis movement range	20mm
4	Actual maximum printing speed	40000 points per hour
5	Theoretical maximum printing speed	72000 hours per hour
6	motor system	The X-axis adopts linear motor and grating ruler positioning The Y-axis adopts servo motor driver+grinding ball screw+grating ruler
7	XY axis resolution accuracy	±0.001mm
8	Repeated dispensing accuracy	±0.015mm
9	Alignment method	vision alignment
10	pad size	Minimum 0201 (01005 optional) components and ICs of various sizes (ICs with pin spacing less than 0.5mm, BGA with ball diameter less than 0.5mm, optional)
11	programming method	CAD/Gerber file import/importing image learning/keyboard input
12	Minimum diameter of solder paste	0.3mm (0.15mm solder paste, nozzle to be customized)
13	Solder paste temperature control	Room temperature to 60 ° C
14	Solder paste selection	Solder paste or silver paste (optional)
15	operating system	WINDOWS XP、WIN7
16	compressed air	0.6Mpa， Gas flow rate ≥ 200L/M
17	power supply	380v，50Hz，10kw
18	weight	750kg
19	External volume	1685（L)×780(W)×1440(H)