Vacuum eutectic reflow soldering furnace H3

NegotiableUpdate on 02/02

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

Application areas: IGBT modules, MEMS packaging, high-power device packaging, optoelectronic device packaging, airtight packaging, etc

Product Details

Application fields:IGBTModules, MEMS packaging, high-power device packaging, optoelectronic device packaging, airtight packaging, etc.
Equipment Introduction:
1. Observation system: The cavity has a visual window that allows real-time observation of the welding process
2. Heating system: The equipment is equipped with 3 sets of heating systems and operates in a vacuum environment.
3. Vacuum system: The equipment is equipped with a directly connected high-speed rotary vane vacuum pump, which can quickly achieve a high vacuum environment of 0.1mbar in the furnace chamber.
4. Cooling system: The equipment adopts a water cooling system to ensure rapid cooling in a high-temperature vacuum environment.
5. Software system: Temperature rise and fall programmable control, temperature rise and fall curves can be set according to the process, and each curve can be automatically generated, edited, modified, stored, etc.
6. Control system: Software modular design can independently set process curves, vacuum extraction, atmosphere, cooling, etc., and can merge production processes to achieve one click operation.
7. Atmosphere system: The equipment can achieve helpless flux welding and can be filled with reducing or protective gases such as H2, N2/H2 mixed gas, HCOOH, N2, etc.
8. Data recording system: equipped with uninterrupted real-time monitoring and data recording system, software curve recording, temperature control curve saving, process parameter saving, equipment parameter recording, and calling.
9. Protection system: eight system safety status monitoring and safety protection designs (welding over temperature protection, whole machine temperature safety protection, low and high air pressure alarm protection, water pressure protection, safety operation protection, cooling water circuit protection during welding, liquid level protection, power outage protection).

Characteristics:
1. High vacuum degree: 0.01mbar high vacuum, real-time display of chamber vacuum degree value, and controllable and adjustable
2. Vacuum pumping speed, 50 m ³/h
3. Process chamber pressure: 0.1mbar
4. Heating plate partition load-bearing capacity, single-layer load-bearing capacity ≥ 20 kilograms
5. Rapid cooling speed: Independent water and gas cooling devices are installed in the chamber to achieve rapid cooling of the welded components.
6. Welding quality with low porosity: Ensure that after welding, large-area solder pads achieve a porosity of less than 3%
7. It can meet the high-temperature welding requirements of materials such as gold solder pads, high lead solder, lead-free solder paste, and the technical requirements for high-quality welding in solder paste vacuum environment.
8. High production capacity: The actual welding area of each layer is 410 * 540mm, and multiple layers work simultaneously to achieve large-scale production of devices.

Technical Specifications:

Model number	H3
Welding area	410 * 540 * 3 layers
Furnace height	100mm
single-layer load-bearing	20KG
maximum temperature	350℃ — 450℃
control system	Temperature control system+vacuum system+cooling system+atmosphere system+software control system
Control method	Brand industrial computer+software system
temperature curve	40 segment temperature control
rated power	60KW
Actual Power	35KW
weight	900KG
真空度	0.1mbar/0.0001mbar
temperature range	Room temperature -450 ℃
Maximum heating rate	≥70℃/min
Maximum cooling rate	≥120℃/min
Atmosphere restoration	Nitrogen hydrogen mixture, pure hydrogen, nitrogen and other inert gases, as well as formic acid
Cold water system	>100L/min， Outlet temperature: 5-10 ℃
Power supply	380V 50-60A
Overall dimensions	132012201750mm

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