LED soldering special small reflow soldering QS-5188

The welding area adopts infrared heating and forced hot air circulation

The unique design of the hot air circulation duct ensures a more uniform temperature inside the furnace, resulting in better welding results

1Lead free desktop reflow soldering machine QS-5188Product Introduction

QS-5188 Precision Lead freeReflow ovenIt is an advanced technology used for SMT research and small batch productionWelding equipmentThis product adopts high-efficiency far and near infrared heating elements, hot air circulation system, and distributed thermocouple temperature measurement device. By precise control of the microcomputer, the temperature curve of the reflow furnace is controlled more accurately and the temperature of the reflow plane is more uniform. Fully adaptable to the reflow requirements of various binary and multi-element alloy brazing materials and lead-free brazing materials with different formulations. Its temperature curve is precisely adjustable, and the equipment also has functions such as automatic fault detection alarm and automatic shutdown. This product has multiple functions, including surface mount reflow of single and double-sided PCBs, surface mount reflow of aluminum substrates, red glue curing of SMT/plug-in hybrid process surface mount components, PCB/FPC lamination heating, high-temperature solder mask oil curing, high-temperature screen printing process curing, component and thick film circuit curing and packaging, epoxy encapsulation curing of electronic transformers, and drying and baking of electronic transformers.Suitable for the production and research of small and medium batch SMT electronic product processesIt is the most ideal equipment for the research and production of electronic product manufacturing processes.

The operating software is the latest bilingual operating system developed in both Chinese and English. Easy to operate, powerful in functionality, user-friendly, and flexible in setting various parameters. The software has multiple control elements, including multi-point temperature acquisition, temperature control system, hot air system, cooling system, and other mixed programming functions. The collection, storage, and software upgrade space for user process parameters are large. The circuit structure adopts an efficient, durable, and convenient integrated motherboard structure, and the mechanical structure adopts an S-shaped air flow channel, without additional aerodynamic force. The hot air in the studio does not flow naturally, which is beneficial for reducing harmful gas pollution to products and improving the efficiency of hot air. Under the action of exhaust power, the sweeping air channel of the entire studio has no dead corners, and the hot air and exhaust gas are cleaned up and the heat dissipation speed is fast. Can quickly move on to the next workflow. Setting up exhaust ports can facilitate the discharge of exhaust gases outdoors. Reduce exhaust gas and temperature pollution to the working environment.

The setting of the hot air circulation system is beneficial for various precision temperature control processes and temperature sensitive electronic devices to be precisely controlled, resulting in a more uniform temperature in the working room. The heat conduction speed is faster, and the temperature control effect is better. Facilitate gas discharge during curing and packaging. Reduce defects in the discharge of packaging bubbles.

High temperature glass observation chimney. Convenient for observing process issues. The use of aluminum silicate high-temperature resistant and environmentally friendly insulation cotton has been improved and upgraded in terms of performance, structure, and operation.

IILead free desktop reflow soldering machine QS-5188Main technical parameters

1. Input power supply: AC220V/(AC110V order) interface standard order
2. Working frequency: 50-60Hz
3. Maximum input power: 2400W
4. Heating method: infrared radiation and hot air mixed heating method
5. Operating System: QS-5188Bilingual operation in Chinese and Englishsystem
6. Working mode:General SMT reflow, low-temperature lead-free SMT reflow, medium temperature lead-free SMT reflow, high-temperature lead-free SMT reflow, SMT red glue curing, device packaging curing, drying and bakingBaking and other modes, users can set multiple options according to their needs
7. Drawer working area:300x400mm
8. Work disk space height: 60mm
9. Workpan load capacity: 7.5kg
10. Dimensions: 500x372x325mm
11. Packaging box specification: 600x500x400
12. Machine weight: 30kg

IIILead free desktop reflow soldering machine QS-5188Run parameter settings

When the machine or solder paste formula and other process parameters are changed for the first time. Generally, the operating parameters need to be set to meet the requirements of the process. Also, individuals can set up the machine according to different language habits. The equipment is equipped with“General SMT reflow program, low-temperature lead-free SMT reflow program, medium temperature lead-free SMT reflow program, high-temperature lead-free SMT reflow program, SMT red glue curing program, drying and baking program, component packaging curing program”Waiting for multiple working modes.

The "universal SMT reflow program, low-temperature lead-free SMT reflow program, medium temperature lead-free SMT reflow program, high-temperature lead-free SMT reflow program, SMT red glue curing program" are specifically designed for SMT surface mount soldering,The entire process is divided into five temperature stages: preheating, heating, welding, insulation, and cooling.Equivalent to five working temperature zones of chain conveyor type.

“Drying and baking program”The mode is designed for disassembling circuit board components or drying items, with three temperature sections: preheating section, working section, and cooling section. Before the device enters heating operation, please confirm that the temperature and time values set are the same as the material's process requirements

“Component packaging solidification program”The mode is specifically designed for IC bonding packaging, diodes, and transistors IC、 Designed for module packaging and high-temperature curing adhesive packaging. There are four temperature sections: preheating section, exhaust section, solidification section, and cooling section. The exhaust system and hot air system can be programmed to turn on and off at every time according to the process requirements.

In the setting state of the machine, there will be a corresponding mode setting interface, and the operation interface of each mode may vary.

4Lead free desktop reflow soldering machine QS-5188Installation instructions

The cooling air inlet of the machine is located at the bottom of the machine. When installing the machine, a space of at least 150mm should be left behind to facilitate heat dissipation and ventilation. The configuration of power sockets must meet the capacity requirements of 220V/15A and 110V/30A or above. There are no flammable objects or gases around the machine. The room where the machine is installed must be ventilated. The temperature is between 15-25 ℃ and the humidity is between 50-90%.

1. The equipment should be installed in a convenient location for short distance exhaust pipes. The power supply is equipped with a 25A high current three pin socket, and the grounding terminal must be reliably grounded.
2. The exhaust pipe should be made of aluminum with a diameter of 120mm, and the outlet height of the exhaust pipe should be at least 1000mm higher than the installation height of the machine. Beneficial for utilizing the chimney exhaust effect of hot air.
3. Machines that are used for a short period of time do not need to be equipped with exhaust pipes. But the distance between the back end of the machine and the wall should be increased by at least 200mm.
4. Do not place any other objects, especially flammable liquids, at the top of the machine. Such as "board wash water, thinner, alcohol, methanol, gasoline", etc.
5. The cleaning of the machine can be done while the machine is cooling down and turned off. Use a cleaning cloth dipped in board water or anhydrous alcohol to scrub the inside of the machine, and use a water-based cleaning machine to scrub the outside. Wait until the machine is completely dry before turning it on for use.
6. At the beginning of use, the machine may emit some odorous gases, which is a normal phenomenon. After a period of use, this odor will disappear.
7. When the machine is not in use, the power switch at the back of the machine should be turned off. In the software shutdown state, the main control board of the machine is still working. When not in use for a long time, the machine should be disassembled, packaged, and returned to its original packaging box for storage. To prevent moisture and small insects and mice from crawling inside and damaging the machine.
8. When using a reflow oven to reflow small PCB or FPC boards, a carrier board made of high-temperature mica should be used, with a minimum gap of 30mm on all four sides. To ensure temperature uniformity. A good reflow process requires precise testing with this machine before storage and use. The built-in temperature curve of the machine is only used as a reference for adjustment. For precision PCB board reflow, please make sure to turn on the hot air system and do not set the time for each stage too short to ensure temperature accuracy and uniformity. Try to use low-temperature and long-term reflow temperature curves to solder back and forth temperature sensitive precision components, such as“LED、 Laser head, miniature connector, soft package IC, camera”Wait.In the case of high temperature resistance of components, the temperature of the "welding section" can be appropriately increased to reduce the reflow time.
9. When turning on the hot air system, there may be a vortex hot air exchange area. Be careful to avoid this area. There may be a phenomenon of excessively high intermediate temperature when the hot air system is not turned on. At the same time, the temperature rise process will accelerate.

5Lead free desktop reflow soldering machine QS-5188Precautions

1. Please use a dedicated power socket with a capacity of 15A or above separately. Do not share the same power socket with other appliances, and the power socket must be reliably grounded. The reflow oven should be placed horizontally or at a height of 3mm at the front end of the machine to prevent the work tray from sliding forward during use. There should be a gap of at least 200mm between the surrounding area and the wall.
2. Do not use the reflow oven in damp or high-temperature environments.
3. Do not rinse the body directly with water to avoid damaging the insulation performance of the body.
4. Do not insert or block foreign objects such as wire into air vents and exhaust vents to avoid burns or affecting ventilation and heat dissipation.
5. Do not bring flammable or explosive hazardous materials near this welding furnace; Items containing flammable and explosive gases should not be dried to avoid danger.
6. Please avoid colliding with the body to avoid damaging the heating tube. If the heating tube is found to be broken, the power should be turned off and sent for repair.
7. When working or before the machine has cooled down to a safe temperature, do not put your hands into the chassis to avoid burns. The "high-temperature glass window" section will have a higher temperature. Do not touch while working.
8. Do not use the reflow oven on a tablecloth to prevent blockage of the air inlet.