Vacuum eutectic reflow soldering furnace V4

[Introduction]

1. The V series vacuum eutectic reflow soldering furnace is taken from the first letter of the English word VACUUM. It means a professional industrial grade vacuum eutectic reflow soldering furnace.

2. Why use a vacuum eutectic reflow soldering furnace? At present, the mainstream welding processes in the industry are using tools or equipment such as soldering irons, wave soldering, and reflow soldering. Later, with the addition of nitrogen protection, they were upgraded to nitrogen lead-free reflow soldering machines. However, for some welding fields with high requirements, such as military products and industrial grade high reliability products, even nitrogen protection cannot meet the reliability requirements of the products. For welding requirements of high reliability in circuits such as material testing, chip packaging, power equipment, automotive products, train control, aerospace, aviation systems, etc., it is necessary to reduce the voids and oxidation of welding materials. Vacuum eutectic reflow soldering furnace is an ideal choice for effectively reducing void rate and minimizing oxidation of solder pads or component pins. To achieve high welding quality, adoptVacuum reflow solderingMachine. This is the technological innovation of SMT welding in countries such as Germany, Japan, and the United States.

3. Industry application: The V series vacuum eutectic reflow soldering furnace is an ideal choice for R&D, process research and development, and low to high production capacity. It is also an ideal choice for research and development and production in military enterprises, research institutes, universities, aerospace and other fields.

4. Application areas: Mainly used for defect free soldering and flux free soldering of chips and substrates, shells and covers, etc., such as IGBT packaging, solder paste process, laser diode packaging process, hybrid integrated circuit packaging, shell and cover packaging, MEMS and vacuum packaging.

5. The vacuum eutectic reflow soldering furnace has become a choice for military enterprises, aviation, aerospace and other manufacturing industries in developed countries such as Europe and America, and has been widely used in fields such as chip packaging and electronic soldering.

[Features]

1. Welding in a true vacuum environment. Vacuum<5Pa. (Optional molecular pump vacuum can reach)10^-3Pa)

2. Welding environment with low activity flux.

3. The touch screen control combined with professional software control achieves a good operating experience.

4. A programmable temperature control system with up to 40 segments in the industry, capable of setting process curves.

5. The temperature setting adopts touch based lifting, and by directly manually pulling the curve, a process closer to the welding material process curve can be set.

6. Water cooling technology achieves rapid cooling effect.

7. Four sets of online temperature measurement functions. Effective measurement of temperature uniformity in the welding area. Provide support for process tuning.

8. Formic acid, nitrogen or other inert gases can be selected to meet the welding requirements of special processes.

9. A designed online real-time process video recording system. Video recording of the welding process for each product provides strong evidence for future quality tracking feedback, while also providing data support for research on welding processes and material samples.

10. The maximum temperature is 450 ℃ (higher optional), meeting all the requirements of soft soldering processes.

11. Observation window is installed on the top cover of the vacuum eutectic reflow soldering furnace chamber.

12. Eight system safety status monitoring and safety protection design (welding over temperature protection, whole machine temperature safety protection, air pressure protection, water pressure protection, safety operation protection, cooling water circuit protection during welding, liquid level protection, power outage protection).

1. One host

2. One industrial touch screen control computer

3. One set of temperature controller

4. One set of pressure controller

5. A set of closed-loop water cooling system

6. One set of four-way temperature measurement module

7. One set of vacuum pressure transmitter

8. One set of inert gas or nitrogen control valves

9. One set of water tank

10. One set of chiller

[Optional]

1. Corrosion resistant diaphragm pump, vacuum 10mba

2. Rotary vane pump, vacuum less than 5Pa

3. Vortex molecular pump system, used for10^-3PaThe vacuum

4. Formic acid (installed locally)

5. Component fixtures

6. 110V power supply system