Explanation of Rapid Temperature Change Test Chamber

The rapid temperature and humidity change test chamber is mainly used to investigate the failure caused by the thermal mechanical properties of the product. The temperature change rate is generally less than 20 ℃/minute, achieving the fastest speed to truly reproduce the application environmental conditions of the tested sample. When the thermal matching of the materials that make up the various components of a product is poor, or when the internal stress of the components is high, temperature cycling tests can cause the product to fail due to mechanical structural defects. Generally used for screening testing and failure mode assessment of optoelectronic devices, interconnect circuits, component units, and electronic equipment. It is an effective method for discovering product design defects and process issues