DRX-II-300A Intelligent Flat Thermal Conductivity Tester for Insulation Materials

This instrument is mainly used to test the thermal conductivity of solid materials such as building engineering thermal insulation materials, thermal insulation materials, glass, fiber, foam, etc. Test materials include fiberboard, loosely filled glass fiber, ceramic fiber, (XPS/EPS/PUR, etc.) foam plastic, interlayer composite board, vacuum board, rubber products, cement products, powder materials, filling materials, gypsum board, etc. Compliant with the latest national standard GB/T 10294-2008 Protection Hot Plate Method, ASTM C 518, ISO 8302 and other testing standards, it has made significant improvements and upgrades to the original DRX-I-PC dual panel instrument technology, with triple temperature protection to reduce environmental thermal interference. The test piece can achieve automatic parallel adjustment with the hot and cold plates, and the non parallel error on both sides of the test piece is very small. The cold surface has electronic refrigeration technology and other refrigerants such as water medium for users to choose from. The precise and stable temperature control technology computer interface, software real-time measurement and control, data processing and storage and other advanced technologies fully meet the requirements of the national standard for thermal conductivity measurement. Applied to material performance testing institutions, scientific research institutions (institutes), factory quality testing departments, and teaching and research in higher education institutions.
Main technical indicators
(1) Configurable online real-time thickness measurement and reading device, eliminating the need for manual measurement of specimens.
(2) Configurable real-time online detection, display, and regulation of specimen pressure
(3) Built in dual panel structure design and insulation technology, circuit design with high-precision temperature detection and compensation functions.
(4) Built in fuzzy PID protective plate - hot plate temperature tracking and precision control technology
(5) Self calibration function for thermal conductivity and heating power
(6) Compensation function for specimen thickness and average temperature
(7) A fully automatic thermal analysis measurement software system with WINDOWS operating interface, featuring data analysis and report output functions.
(8) The thickened thermal conductivity meter can accurately measure the thermal conductivity of thickened specimens, with a maximum specimen thickness of up to 200mm.
(9) Power supply voltage: AC 220V ± 5%, power: 3.0kW
(10) Measurement range of thermal conductivity: 0.01~2.2 W/m · K,
Measurement repeatability: ± 1.0%, measurement accuracy: ± 2.5%
(11) Temperature measurement range: minimum cold plate temperature -40 ℃, minimum set cold plate temperature: -40~60 ℃
(12) Hot plate setting temperature: Room temperature~110 ℃, 300 ℃, 600 ℃ (optional),
Minimum temperature for cold noodles: -10 ℃ -20 ℃, -40 ℃ (optional); Temperature control accuracy: 0.1 ℃
Temperature measurement accuracy: 0.1 ℃ Temperature resolution: 0.01 ℃
Cold face refrigeration: electronic semiconductor refrigeration, compressed air cooling, cooling water refrigeration, ethanol medium compressor refrigeration methods to choose from
(13) Environmental conditions: Room temperature: 18-25 ℃, humidity: 20-80% RH
(14) Requirements for flat test specimens:
Standard thickness: Conventional thermal conductivity meter: 25 ± 1 mm (recommended by national standards), up to a maximum of 50 mm
Thickened thermal conductivity meter: 60-100 mm, with a maximum of 200 mm,
Flatness:<0.5mm, Hardness: Suitable for various related hard materials, and can also be measured for related soft materials,
Powder sample requirements: No special requirements. Can be paired with a powder testing device box.
(15) Temperature control accuracy: Hot plate (± 0.1 ℃) Cold plate (± 0.1 ℃)
(16) Sample size requirements (mm): 200 × 200 × (5-20), 300 × 300 × (5-100),
400×200×200
(17) Equipped with fully automatic thermal analysis software: Windows XP/s2 Chinese and English operating interface
This model comes in two types: horizontal and vertical. The appearance is for reference only and is subject to factory inspection