Solder joint thrust testing machine, chip thrust testing machine, pressure strength testing machine, compression and thrust strength testing machine are widely used in semiconductor packaging, optical communication equipment packaging, LED packaging, COB/COG process testing, material mechanics research in research institutes, material reliability testing and other application fields
Solder joint thrust testing machine, chip thrust testing machine, pressure strength testing machine, compressive and thrust strength testing machine
Widely used in semiconductor packaging, optical communication equipment packaging, LED packaging, COB/COG process testing, research institute material mechanics research, material reliability testing and other application fields, it is an indispensable dynamic mechanical testing instrument for Bond process, SMT process, bonding process and other applications. It can meet the specific application needs of tensile testing of metals, copper wires, alloy wires, aluminum wires, aluminum strips, thrust testing of gold balls, copper balls, tin balls, wafers, chips, surface mount components, pull testing of tin balls, BumpPin and other materials. It has strong expandability, convenient operation, and high testing capability.

SGL WT20 Micro Solder Joint Thrust Testing Machine Chip Shear Force Testing Machine SMT Welding Component Thrust Testing Machine
0.1 gram thrust machine chip shear force testing machine
1、 Technical parameters:
1. Testing accuracy
Thrust: 0.1g
Tensile strength: 0.01g
2 Testing Scope
Thrust: 0-500g
Tensile strength: 0-300g
Internal lead tensile testing machine, micro solder joint thrust testing machine, chip shear testing machine, SMT welding component thrust testing machine
3. Work itinerary range: 70MM, resolution: 0.02MM
4Z worktable travel range 50MM resolution: 0.02MM
5 User interface: Chinese interface, English interface
6 Operating System: Control System+WINDOWS Interface Data Operation
7 Power Supply: Power 200W (MAX300W) Frequency 50/60HZ
8 Weight: 35KG
9 Dimensions: 500mm * 550mm * 400mm
2、 Currently implemented testing functions:
1. Internal lead tension test;
2. Micro solder joint thrust test;
3. Chip shear force test;
4. SMT welding component thrust test
5. BGA matrix overall thrust test
The overall system degree of the equipment reaches below 0.1% (publicly declared 0.25%), fully meeting any demanding IC manufacturing process requirements. This includes the emerging LED packaging industry in China, as well as traditional semiconductor manufacturing and technology industries, and research institutes in universities and colleges.


Chip shear force testing machine, fully automatic micro thrust testing machine
