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E-mail
info@dervee.com
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Address
Room 409, Yangtze River Delta International R&D Community, Xiangcheng Avenue, Suzhou High Speed Rail New City
Suzhou De'er Micro Instrument Co., Ltd
info@dervee.com
Room 409, Yangtze River Delta International R&D Community, Xiangcheng Avenue, Suzhou High Speed Rail New City
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The high-precision TEM wafer punch (hole punch) 1700-3B, innovatively developed by DeEr Micro Instruments, is used to achieve distortion free transmission electron microscopy (TEM) sample preparation. The TEM wafer punch is highly suitable for processing tough and ductile materials such as metals, with punching thicknesses ranging from 50 micrometers to 120 micrometers. The sample area of the material to be stamped is clearly visible, making it easy to select the area of interest for sampling. The TEM wafer punch 1700-3B from DeEr Micro can easily punch 3mm wafers from thin films. The standard cutting diameter is 3mm, and the punching diameter can be customized.
Why do we need a TEM wafer punch?
The preparation of TEM samples is usually a lengthy process that consumes a lot of time and cost. Uncontrollable factors during the sample preparation process can be frustrating and may also lead to sample damage and misleading test results. Therefore, in the first step of TEM sample preparation, samples are taken and non-destructive "punching" is performedThe 'hole' is very important.
The concave head of the punch can prevent vertical compression of the stamping material. By precise coordination between the punch and the lower mold base, precise guiding mechanism, and spring support protection for the sample, the final obtained circular edge is guaranteed to be smooth, clean, deformation free, and burr free.
Operation demonstration video User Experience
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