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Beijing Yakechenxu Technology Co., Ltd
EVG 320 Wafer Cleaning System
NegotiableUpdate on 03/19
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Overview
EVG 320 is an automatic single crystal round cleaning equipment that uses megasonic cleaning to clean the wafer surface before bonding, improving bonding quality.
Product Details
Product Introduction:
EVG 320 is an automatic single crystal round cleaning equipment that uses megasonic cleaning to clean the wafer surface before bonding, improving bonding quality.
Main features and parameters:
·Maximum applicable to 12 inch (300mm) wafers
·FOUP to FOUP or Cassette to Cassette fully automatic operation
·Using 1MHz megasonic cleaning hair to effectively remove particles larger than 1 μ m
·Up to 4 cleaning chambers can be configured
·Robot processing ensures pre alignment accuracy
