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Beijing Yakechenxu Technology Co., Ltd
EVG 620BA Alignment System
NegotiableUpdate on 03/19
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Overview
EVG 620BA is a semi-automatic research and development type bonding alignment device that uses double-sided optical alignment and has a fully automatic high-resolution bottom camera, suitable for bonding alignment of EVG501, EVG510, and EVG520 bonding machines.
Product Details
Product Introduction:
EVG 620BA is a semi-automatic research and development type bonding alignment device that uses double-sided optical alignment and has a fully automatic high-resolution bottom camera, suitable for bonding alignment of EVG501, EVG510, and EVG520 bonding machines.
Main features and parameters:
·Maximum support for 6-inch (150mm) wafers
·Support alignment of 2-layer or 3-layer wafer stacking
·Alignment accuracy:
Bottom alignment accuracy ≤± 2 μ m 3 σ
Transparent alignment accuracy ≤± 1 μ m 3 σ
·Optional infrared alignment
·Upgradeable to automatic alignment
