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Beijing Yakechenxu Technology Co., Ltd
EVG SmartView NT Alignment System
NegotiableUpdate on 03/19
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Overview
EVG SmartView NT is a fully automated mass-produced bonding alignment device suitable for 3D interconnects, wafer level packaging, and high-yield MEMS. It can be integrated as a module in EVG560 bonding devices or GEMINI platforms.
Product Details
Product Introduction:
EVG SmartView NT is a fully automated mass-produced bonding alignment device suitable for 3D interconnects, wafer level packaging, and high-yield MEMS. It can be integrated as a module in EVG560 bonding devices or GEMINI platforms.
Main features and parameters:
·Maximum support for 12 inch (300mm) wafers
·Support alignment of 2-layer or 3-layer wafer stacking
·Support: Face to face alignment, back alignment, infrared alignment, and transparent alignment
·Upgradeable to automatic alignment
