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Beijing Yakechenxu Technology Co., Ltd
Trymax NEO3000 series automatic dry adhesive removal
NegotiableUpdate on 03/19
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Overview
Trymax NEO3000 series automatic dry adhesive removal
Product Details
【 Main Applications 】
Previous: Light Etching; Descum strip； PR Ashing； After ion implantation, photolithography, and coating processes;
Backward/Advanced Packaging/3D IC: Descum Bumping; Plasma Treatment； Wafer Cleaning, etc.
【 Main Parameters 】
2/3 loading and unloading mechanism (300mm)
5-axis robotic arm
Single RF source configuration (13.56MHz)
Single microwave source configuration (2.45GHz)
Dual source configuration (RF/MW)
DCP dual source (RF/RF)
• Suitable for wafer 200mm~300mm
