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Beijing Yakechenxu Technology Co., Ltd

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    Room 616, 6th Floor, Zhaowei Building, No. 14 Jiuxianqiao Road, Chaoyang District, Beijing

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Trymax3400 series automatic dry adhesive removal

NegotiableUpdate on 03/19
Model
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Overview
Trymax3400 series automatic dry adhesive removal
Product Details
【 Main Applications 】
Previous: Light Etching; Descum strip; PR Ashing; After ion implantation, photolithography, and coating processes;
Backward/Advanced Packaging/3D IC: Descum Bumping; Plasma Treatment; Wafer Cleaning, etc.
【 Main Parameters 】
4 loading and unloading mechanisms (300mm)
4-axis robotic arm paired with X movement
Single RF source configuration (13.56MHz)
Single microwave source configuration (2.45GHz)
Dual source configuration (RF/MW)
DCP dual source (RF/RF)
• Suitable for wafer 200mm~300mm